公开(公告)号：US20200070300A1

公开(公告)日：2020-03-05

申请号：US16268753

申请日：2019-02-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun Kyung HONG ,  Nam Il KOO ,  Ji Min LEE ,  Sung Hyup KIM ,  Sang Yeon OH ,  Ik Seon JEON ,  Ji Min CHOI

IPC: B24B37/013 ,  B24B49/12

Abstract: A chemical mechanical polishing apparatus includes a polishing head, including a polishing head body, a membrane attached to a lower portion of the polishing head body, and a reflector disposed between the polishing head body and the membrane, a platen including an opening, an emitter disposed below the opening of the platen, the emitter configured to emit terahertz waves, a detector disposed below the opening of the platen, the detector configured to receive the terahertz waves emitted by the emitter and reflected by the reflector, and an analyzer configured to analyze an electrical signal generated by converting the terahertz waves received by the detector, the analyzer configured to determine a polishing end point.