公开(公告)号：US20220020656A1

公开(公告)日：2022-01-20

申请号：US17185116

申请日：2021-02-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghoon JUNG ,  Young Lyong KIM ,  Cheolsoo HAN

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L21/56 ,  H01L25/18

Abstract: Disclosed is a semiconductor package comprising a lower substrate including a conductive line; a first semiconductor chip on the lower substrate; an under-fill layer between the first semiconductor chip and the lower substrate, the under-fill layer including a central part below the first semiconductor chip and an edge part isolated from direct contact with the central part in a first direction parallel to a top surface of the lower substrate, and a recess region between the central part and the edge part. The recess region may be defined by a sidewall of the central part, a sidewall of the edge part, and a top surface of the conductive line in the lower substrate.

公开(公告)号：US20210225422A1

公开(公告)日：2021-07-22

申请号：US17034058

申请日：2020-09-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sanghoon JUNG

IPC: G11C11/4074 ,  G11C11/4091

Abstract: Provided are a voltage generator circuitry for generating an internal power supply voltage of a memory device and an operation method thereof. In the memory device, a voltage generator circuitry generates a first internal power supply voltage when the memory device is in an active mode, generates a second internal power supply voltage when the memory device is in a standby mode, and provides the first internal power supply voltage or the second internal power supply voltage to an internal power supply voltage line for using as an internal power supply voltage of the memory device. When the memory device is in the standby mode, the voltage generator circuitry blocks generation of the first internal power supply voltage by using a first voltage higher than an external power supply voltage.

公开(公告)号：US20230127496A1

公开(公告)日：2023-04-27

申请号：US17974002

申请日：2022-10-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sukchul PARK ,  Beommo SEONG ,  Sanghoon JUNG ,  Woonbae KIM ,  Jinsu PARK ,  Byounguk YOON

IPC: H05K5/02 ,  H04B1/3818

Abstract: An electronic device includes a circuit board, a socket on the circuit board and electrically connected to the circuit board, and a tray removably insertable into the socket from outside the electronic device, the tray including a body portion, a first protrusion extended from the body portion, and a second protrusion extended from the body and spaced apart from the first protrusion. The socket includes a detection portion which is engageable with the first protrusion of the tray and detects insertion of the tray in the socket, together with the circuit board, and a supporting portion which is engageable with the second protrusion of the tray. The tray which is inserted into the socket disposes the first protrusion contacting the detection portion, and a portion of the tray corresponding to the second protrusion supported by the supporting portion.