公开(公告)号：US12205852B2

公开(公告)日：2025-01-21

申请号：US17460207

申请日：2021-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangmin An ,  Haengjin Lee ,  Changseok Han ,  Taehwan Oh ,  Minchul Jun ,  Byeongcheol Choi

IPC: H01L21/66 ,  G01R31/28 ,  G01R31/3185 ,  G11C14/00 ,  H01L23/31 ,  H01L25/065

Abstract: A method of manufacturing a multi-chip package (MCP) is provided. The MCP includes a first type semiconductor chip, a second type semiconductor chip, and a memory controller configured to control the second type semiconductor chip. The method includes mounting the first type semiconductor chip and the memory controller on a substrate, mounting the second type semiconductor chip on the first type semiconductor chip, forming a mold layer to cover the first and second type semiconductor chips and the memory controller, performing a function test on the first type semiconductor chip and simultaneously determining whether a crack defect occurred in the second type semiconductor chip. The crack defect of the second type semiconductor chip is determined when a current measured in a low power mode test of the second type semiconductor chip is greater than or equal to a test reference value.