公开(公告)号：US20220246089A1

公开(公告)日：2022-08-04

申请号：US17712687

申请日：2022-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun SONG ,  Sangtae HAN ,  Huigyeong AHN ,  Changsun KANG ,  Mijin KIM ,  Seongjun KIM ,  Changjun PARK ,  Seunghee OH ,  Kyoree LEE ,  Mihyun LEE

IPC: G09G3/32

Abstract: A display apparatus is provided. The display apparatus includes a substrate having a data line disposed thereon, a plurality of pixel modules arranged in a matrix format on the substrate, and a driver providing a digital data signal through the data line to each of the pixel modules. Each of the pixel modules may include a light emitting layer in which a plurality of light emitting diode (LED) devices form a pixel, a driving layer comprising a display driver integrated circuit (DDI) below the light emitting layer and generating a driving signal to drive the LED devices, and a substrate layer, between the driving layer and the substrate, comprising a data input pad to receive the data signal and transmit the data signal to the DDI and a data output pad to provide the data signal to another adjacent pixel module.

公开(公告)号：US20210167055A1

公开(公告)日：2021-06-03

申请号：US17105890

申请日：2020-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsun KANG ,  Mijin KIM ,  Seongjun KIM ,  Huigyeong AHN ,  Kyoree LEE ,  Sangtae HAN ,  Changjun PARK

IPC: H01L25/18 ,  H01L23/498 ,  H01L27/12 ,  H01L33/62

Abstract: A printed circuit board (PCB) assembly of a micro light emitting diode (LED) display is provided. The PCB assembly includes a PCB including a first face disposed in a first direction and a second face disposed in a second direction opposite to the first direction, at least one thin film transistor (TFT) circuitry constructed directly on the first face, and a plurality of pixels arranged on the first face and electrically coupled to the at least one TFT circuitry.

公开(公告)号：US20190326267A1

公开(公告)日：2019-10-24

申请号：US16275607

申请日：2019-02-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangtae HAN ,  Taesang PARK ,  Changsun KANG ,  Mijin KIM ,  Kyoree LEE

IPC: H01L25/16 ,  H01L33/62 ,  H01L23/538 ,  H01L27/12 ,  H01L21/768 ,  H01L23/00 ,  G09G3/32

Abstract: A display according to various embodiments of the present disclosure may include: a first face oriented in a first direction; a second face oriented in a second direction opposite the first direction; a plurality of pixels disposed in a space between the first face and the second face; and a plurality of pins disposed on the second face and configured to electrically connect the plurality of pixels to an external device. Each of the plurality of pixels may include a plurality of LEDs and a driving circuit, the plurality of LEDs may be disposed in the space such that light-emitting portions thereof face the first face, a conductive pattern configured to electrically connect the plurality of LEDs to the driving circuit may be located in the space, at least a portion of the conductive pattern being located above the plurality of LEDs when viewed from above the second face, and a wiring line configured to electrically connect the driving circuit to the plurality of pins may be located in the space, the wiring line being located above the plurality of LEDs when viewed from above the second face.

公开(公告)号：US20220415873A1

公开(公告)日：2022-12-29

申请号：US17902611

申请日：2022-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changsun KANG ,  Huigyeong AHN ,  Kyungwoon JANG ,  Sangtae HAN ,  Daesuck HWANG

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  G09G3/32 ,  G09G3/20

Abstract: A display module includes a first substrate; a plurality of micro-pixel packages provided on an upper surface of the first substrate and including a plurality of pixels arranged in two dimensions; a plurality of micro-pixel controllers provided on the upper surface of the first substrate and configured to control the plurality of micro-pixel packages; and a driver integrated chip (IC) configured to transmit a driving signal to the plurality of micro-pixel controllers, wherein upper ends of the plurality of micro-pixel packages are positioned higher than upper ends of the plurality of micro-pixel controllers with respect to the upper surface of the first substrate.