公开(公告)号：US20210167055A1

公开(公告)日：2021-06-03

申请号：US17105890

申请日：2020-11-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsun KANG ,  Mijin KIM ,  Seongjun KIM ,  Huigyeong AHN ,  Kyoree LEE ,  Sangtae HAN ,  Changjun PARK

IPC: H01L25/18 ,  H01L23/498 ,  H01L27/12 ,  H01L33/62

Abstract: A printed circuit board (PCB) assembly of a micro light emitting diode (LED) display is provided. The PCB assembly includes a PCB including a first face disposed in a first direction and a second face disposed in a second direction opposite to the first direction, at least one thin film transistor (TFT) circuitry constructed directly on the first face, and a plurality of pixels arranged on the first face and electrically coupled to the at least one TFT circuitry.

公开(公告)号：US20220246089A1

公开(公告)日：2022-08-04

申请号：US17712687

申请日：2022-04-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seunghyun SONG ,  Sangtae HAN ,  Huigyeong AHN ,  Changsun KANG ,  Mijin KIM ,  Seongjun KIM ,  Changjun PARK ,  Seunghee OH ,  Kyoree LEE ,  Mihyun LEE

IPC: G09G3/32

Abstract: A display apparatus is provided. The display apparatus includes a substrate having a data line disposed thereon, a plurality of pixel modules arranged in a matrix format on the substrate, and a driver providing a digital data signal through the data line to each of the pixel modules. Each of the pixel modules may include a light emitting layer in which a plurality of light emitting diode (LED) devices form a pixel, a driving layer comprising a display driver integrated circuit (DDI) below the light emitting layer and generating a driving signal to drive the LED devices, and a substrate layer, between the driving layer and the substrate, comprising a data input pad to receive the data signal and transmit the data signal to the DDI and a data output pad to provide the data signal to another adjacent pixel module.

公开(公告)号：US20230272280A1

公开(公告)日：2023-08-31

申请号：US18098847

申请日：2023-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjun PARK ,  Jaesung LEE ,  Junghun LIM ,  Jungmin OH ,  Sangwon BAE ,  Hyosan LEE

IPC: C09K13/10 ,  H01L21/306 ,  H10B12/00 ,  C09K13/08

CPC classification number: C09K13/10 ,  C09K13/08 ,  H01L21/30604 ,  H10B12/05 ,  H10B12/30

Abstract: An etchant composition for etching a silicon germanium film includes, based on a total weight of the etchant composition, about 5 wt% to about 14 wt% of an oxidant, about 0.01 wt% to about 5 wt% of a fluorine compound, about 0.01 wt% to about 5 wt% of an amine compound, about 0.01 wt% to about 1 wt% of an alcohol compound having a hydrophilic head and a hydrophobic tail, about 60 wt% to about 90 wt% of an organic solvent, and a balance of water. A method of manufacturing an integrated circuit device includes: forming, on a substrate, a structure in which a plurality of silicon films and a plurality of silicon germanium films are alternately stacked; and selectively removing the plurality of silicon germanium films by using the etchant composition.

公开(公告)号：US20230272278A1

公开(公告)日：2023-08-31

申请号：US18081899

申请日：2022-12-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changjun PARK ,  Jaesung LEE ,  Junghun LIM ,  Mihyun PARK ,  Sangwon BAE ,  Jungmin OH ,  Hyosan LEE

IPC: C09K13/06 ,  H01L21/3213 ,  H01L21/768 ,  H01L21/3205

CPC classification number: C09K13/06 ,  H01L21/32134 ,  H01L21/76883 ,  H01L21/32051

Abstract: An etching composition for etching a molybdenum film, the etching composition includes about 0.1 wt % to about 5 wt % of an oxidant; about 10 wt % to about 40 wt % of a chelate agent, the chelate agent including a mineral acid; about 0.01 wt % to about 3 wt % of a corrosion inhibitor, the corrosion inhibitor including an ammonium salt, an amine compound, or a combination thereof; and an organic solvent, all wt % being based on a total weight of the etching composition.