公开(公告)号：US20220026488A1

公开(公告)日：2022-01-27

申请号：US17337066

申请日：2021-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong Kim ,  Se-Hyun Seo ,  Hyungil Kim ,  Sangjae Rhee ,  Youngchyel Lee

IPC: G01R31/28 ,  H01L21/78 ,  H01L21/66

Abstract: A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.

公开(公告)号：US11604220B2

公开(公告)日：2023-03-14

申请号：US17517057

申请日：2021-11-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyung Il Kim ,  Se-Hyun Seo ,  Byeong Min Yu ,  Jae Hong Kim ,  Sang Jae Rhee ,  Young Chyel Lee

IPC: G01R31/28 ,  G01R1/04

Abstract: A test apparatus includes a first module configured to structurally support a target semiconductor device, and a second module reversibly attachable to the first module. The first module includes a first housing including one or more inner surfaces at least partially defining an inner space, a volume control unit configured to control a volume of the inner space, a mounting unit at least partially exposed to the inner space and configured to be exposed to the target semiconductor device, and a magnetic force control unit in the first housing. The second module includes a second housing, a test board in the second housing, and an attachable/detachable member in the second housing. The test board may be electrically connected to the target semiconductor device. The magnetic force control unit may control a magnetic property of the attachable/detachable member to cause the attachable/detachable member to attach/detach to/from the magnetic force control unit.

公开(公告)号：US11592478B2

公开(公告)日：2023-02-28

申请号：US17337066

申请日：2021-06-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jaehong Kim ,  Se-Hyun Seo ,  Hyungil Kim ,  Sangjae Rhee ,  Youngchyel Lee

IPC: G01R31/28 ,  H01L21/78 ,  H01L21/66 ,  H01L25/065 ,  H01L23/00

Abstract: A semiconductor package test system includes a test pack on which a semiconductor package is loaded, and a semiconductor package testing apparatus. The semiconductor package testing apparatus includes a receiving section that receives the test pack. The receiving section includes a pack receiving slot into which the test pack is inserted. The test pack includes a chuck on which the semiconductor package is fixed, a probe block disposed above the chuck, and a connection terminal. The receiving section includes a receiving terminal that is electrically connected to the connection terminal when the receiving terminal contacts the connection terminal. The probe block includes at least one needle configured to be electrically connected to the semiconductor package disposed on the chuck upon the chuck moving toward the semiconductor package. The receiving section is provided in plural.