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公开(公告)号:US20240429618A1
公开(公告)日:2024-12-26
申请号:US18819279
申请日:2024-08-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bumhee LEE , Seungtae KO , Junsig KUM , Yoongeon KIM , Seokmin LEE , Youngju LEE , Jongmin LEE , Seungho CHOI
Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.
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公开(公告)号:US20230231296A1
公开(公告)日:2023-07-20
申请号:US18186554
申请日:2023-03-20
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bumhee LEE , Yoongeon KIM , Seungho CHOI , Sanghoon PARK , Seokmin LEE , Youngju LEE , Joon HUH
CPC classification number: H01Q1/2283 , H01Q21/065 , H01Q21/0087
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An electronic device including an antenna in a wireless communication system is provided. The electronic device includes a radiator, a body, and a feeding circuit for transmitting a signal, wherein the radiator is coupled to at least a part of the body, the feeding circuit is coupled to the body to support the body, and the radiator is disposed to be spaced apart from the feeding circuit to form an air gap.
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公开(公告)号:US20230187844A1
公开(公告)日:2023-06-15
申请号:US18078356
申请日:2022-12-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jongmin LEE , Seungtae KO , Yoongeon KIM , Sanghoon PARK , Jungmin PARK , Bumhee LEE , Seokmin LEE , Seungho CHOI
CPC classification number: H01Q21/065 , H01Q25/001
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate after a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna in a wireless communication system may include: a plurality of antenna elements including a first antenna element and a second antenna element, the first antenna element and the second antenna element may include patch antennas, the first antenna element and the second antenna element may be disposed at a narrower interval than a reference interval, and the patch antenna may have an asymmetry structure.
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公开(公告)号:US20250038426A1
公开(公告)日:2025-01-30
申请号:US18918817
申请日:2024-10-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seokmin LEE , Yoongeon KIM , Seungho CHOI , Seungtae KO , Jungyub LEE , Jun HUR
Abstract: An electronic device is provided. The electronic device includes an antenna substrate and an antenna array comprising a sub array, the sub array includes a plurality of antenna elements, feeding network circuitry including a first power divider for first polarization and a second power divider for second polarization, which differs from the first polarization, and network circuitry for decoupling of a first signal of the first power divider and a second signal of the second power divider, wherein the sub array is disposed on a first surface of the antenna substrate, and wherein the feeding network circuitry disposed on the first side or a second side opposite to the first side of the antenna substrate, and wherein the network circuitry for decoupling is disposed in a region between the first power divider and the second power divider in the first side or the second side of the antenna substrate.
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公开(公告)号:US20230112285A1
公开(公告)日:2023-04-13
申请号:US18075850
申请日:2022-12-06
Applicant: Samsung Electronics Co., Ltd.
Inventor: Bumhee LEE , Seungtae KO , Junsig KUM , Yoongeon KIM , Seokmin LEE , Youngju LEE , Jongmin LEE , Seungho CHOI
Abstract: The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.
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公开(公告)号:US20230361441A1
公开(公告)日:2023-11-09
申请号:US18185937
申请日:2023-03-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seungho CHOI , Yoongeon KIM , Seokmin LEE , Seungtae KO , Junsig KUM , Jungyub LEE
Abstract: A phase shifter module is provided. The phase shifter module includes a dielectric, a plate, and a PCB including a metal pattern. The metal pattern includes a power divider having first and second transmission branches. The first transmission branch includes a first structure formed between a branch point of the power divider and an output terminal of the first transmission branch. The second transmission branch includes a second structure formed between the branch point of the power divider and the output terminal of the first transmission branch. The dielectric is disposed to overlap at least one of at least a portion of the first structure or at least a portion of the second structure. The dielectric is flexibly disposed so that a first region where the dielectric overlaps the first structure and a second region where the dielectric overlaps the second structure vary, according to movement of the plate.
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公开(公告)号:US20230187845A1
公开(公告)日:2023-06-15
申请号:US18108948
申请日:2023-02-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seokmin LEE , Junsig KUM , Yoongeon KIM , Seungho CHOI , Seungtae KO , Youngju LEE
CPC classification number: H01Q21/065 , H01Q9/045 , H01Q1/246 , H01Q1/52
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). According to an embodiment of the disclosure, an antenna structure of a wireless communication system may include: at least one antenna element including at least one antenna, a power divider configured to feed the at least one antenna element, and a substrate, the at least one antenna element and the power divider may be disposed on the substrate, and, the substrate may include a first dielectric layer having an air layer in a region corresponding to a first region in which the power divider is disposed on the substrate, and a second dielectric layer disposed between the first dielectric layer and the power divider.
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公开(公告)号:US20220398032A1
公开(公告)日:2022-12-15
申请号:US17837286
申请日:2022-06-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wonseb JEONG , Hongju KAL , Won Woo RO , Seokmin LEE , Gun KO
IPC: G06F3/06
Abstract: A data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. The heterogeneous memory system includes a memory module and high bandwidth memory (HBM) including a processing-in-memory (PIM) circuit combined with a memory controller. The memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the HBM by using a border index value when the arithmetic operation is performed by the PIM circuit of the HBM and generate a memory module command set and an HBM command set using physical address spaces respectively designated in the memory module and the HBM.
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公开(公告)号:US20240103755A1
公开(公告)日:2024-03-28
申请号:US18531094
申请日:2023-12-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Wonseb JEONG , Hongju KAL , Won Woo RO , Seokmin LEE , Gun KO
IPC: G06F3/06
CPC classification number: G06F3/0655 , G06F3/0604 , G06F3/0679
Abstract: A data processing system and method for accessing a heterogeneous memory system including a processing unit are provided. The heterogeneous memory system includes a memory module and high bandwidth memory (HBM) including a processing-in-memory (PIM) circuit combined with a memory controller. The memory controller is configured to detect a data array required for an arithmetic operation from a memory module or the HBM by using a border index value when the arithmetic operation is performed by the PIM circuit of the HBM and generate a memory module command set and an HBM command set using physical address spaces respectively designated in the memory module and the HBM.
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公开(公告)号:US20230216179A1
公开(公告)日:2023-07-06
申请号:US18184207
申请日:2023-03-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Junsig KUM , Yoongeon KIM , Seokmin LEE , Seungho CHOI , Youngju LEE
CPC classification number: H01Q1/246 , H01Q21/065
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4th-Generation (4G) communication system such as Long Term Evolution (LTE). An antenna module is provided. The antenna module includes multiple antennas, a distribution circuit disposed to provide an electrical connection with each of the multiple antennas, a metal plate, and a dielectric substrate disposed between a pattern layer of the distribution circuit and the metal plate, wherein the dielectric substrate includes one or more dielectric film layers and one or more adhesive layers.
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