公开(公告)号：US20240355666A1

公开(公告)日：2024-10-24

申请号：US18636612

申请日：2024-04-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Il Choi ,  Seong-Eun Kang ,  Kyung Beom Kim ,  Sung Yoon Ryu ,  Mi Ra Park ,  Yong Kyu Lee ,  Jeung Hee Lee ,  Ju Hyun Lee ,  Nam Young Cho

IPC: H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6838 ,  H01L21/68707

Abstract: A substrate transferring apparatus includes a support plate including an upper surface on which a substrate is configured to be seated, and a vacuum pad detachably coupled to the support plate and configured to vacuum suction the substrate to fix the substrate on the upper surface of the support plate, wherein the vacuum pad includes a suction area and a support protrusion surrounding the suction area, an upper surface of the support protrusion is at a higher vertical level than an upper surface of the suction area to support the substrate, and the upper surface of the support protrusion is inclined relative to horizontal.