公开(公告)号：US20240399532A1

公开(公告)日：2024-12-05

申请号：US18524745

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Junyoung Choi ,  Wonuk Yoon ,  Jaemook Kang ,  Keonwoo Kim ,  Sungyong Park ,  Hoseop Choi ,  Seonmin Yun ,  Jitae Lee

IPC: B24B41/047 ,  B24B37/20

Abstract: A polishing head of a CMP apparatus may include a head block, a distribution block and a segmentation type head module. The head block may configured to be positioned over a substrate. The distribution block may be rotatably connected to a lower surface of the head block with respect to a vertical direction. A plurality of pressure lines may be connected to the distribution block and configured to flow a working fluid therethrough. The segmentation type head module may be connected to the lower surface of the distribution block. The segmentation type head module may be configured to rotate with respect to the vertical direction together with the distribution block. The segmentation type head module may be configured to locally pressurize the substrate using the working fluid provided through the pressure lines.