公开(公告)号：US20240379406A1

公开(公告)日：2024-11-14

申请号：US18394940

申请日：2023-12-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hee Sung LEE ,  Tae Sung KANG ,  Se Min YANG ,  Kyo-Suk CHAE ,  Seung Ho HONG ,  Beom Yong HWANG

IPC: H01L21/762 ,  H01L29/423 ,  H10B12/00

Abstract: A semiconductor device is disclosed. The semiconductor memory device comprises a substrate including an active region, an element isolation film disposed in the substrate and that defines the active region, a recess which is disposed in the active region and extends in a first direction, and a gate structure extending in a second direction, on the active region, wherein the gate structure includes a gate insulating film, a gate stack pattern, and a gate capping pattern which are sequentially stacked, wherein the gate insulating film extends along an upper face of the active region, and a part of the gate insulating film fills the recess, and wherein a height from a lower face of the substrate to a bottom face of the element isolation film is less than a height from the lower face of the substrate to a bottom face of the recess.

公开(公告)号：US20170118871A1

公开(公告)日：2017-04-27

申请号：US15298437

申请日：2016-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang Ho CHOI ,  Wang Byung CHAE ,  Tae Woo KANG ,  Kyo Seung KIM ,  Hyeon U PARK ,  Ji-Ho BAEK ,  Sung Hee LEE ,  Youn Sang JANG ,  Tae Sung CHOI ,  Seung Ho HONG

IPC: H05K7/20 ,  B23P15/26

Abstract: An outdoor unit of an air conditioner having an improved structure to efficiently cool a heating unit of electronic parts therein, a cooling unit applied to the outdoor unit, and a method for manufacturing the cooling unit are provided. The outdoor unit of an air conditioner includes a case, a compressor for compressing a refrigerant, a condenser for condensing a refrigerant discharged from the compressor, electronic parts arranged in the case; and a cooling unit arranged to cool the electronic parts, wherein the cooling unit comprises a heat radiation member arranged to receive and cool down heat produced from the electronic parts, and to come into contact with at least a part of a cooling pipe in which the refrigerant flows, and a plurality of heat transfer fins formed at least some part of the heat radiation member.

公开(公告)号：US20170146249A1

公开(公告)日：2017-05-25

申请号：US15118247

申请日：2015-02-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang Ho CHOI ,  Wang Byung CHAE ,  Hyung Mo KOO ,  Kyung Hoon KIM ,  Kyu Sang PARK ,  Hyun Woo PARK ,  Seung Ho HONG

IPC: F24F1/24 ,  F24F13/20

CPC classification number: F24F1/24 ,  F24F1/06 ,  F24F13/20

Abstract: Embodiments of the present disclosure relate to an outdoor unit of an air conditioner configured to cool a heating unit by making contact with the heating unit, a cooling unit applied thereto, and a method for manufacturing the cooling unit. An outdoor unit of an air conditioner comprises a compressor configured to compress refrigerant; a condenser configured to condense the refrigerant discharged from the compressor; a control box provided with an electronic component configured to control an outdoor unit of an air conditioner; and a cooling unit configured to cool a heating unit by making contact with the heating unit of the electronic component, wherein the cooling unit comprises a heat radiating member having one side thereof make contact with the heating unit; and a refrigerant pipe extended by penetrating through the heat radiating member and in which refrigerant is moved.