公开(公告)号：US20140264936A1

公开(公告)日：2014-09-18

申请号：US14201307

申请日：2014-03-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seung Youl CHOI ,  Jun Hyung KIM ,  Byung Hyun LEE

IPC: H01L23/48

CPC classification number: G11C5/063 ,  G11C7/10 ,  G11C2207/105 ,  H01L25/0657 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor package including a first connection terminal group configured to receive a first signal group from the outside of the semiconductor package, a second connection terminal group configured to transmit a second signal group to the outside, a first chip connected to the first connection terminal group, and a second chip connected to the second connection terminal group and configured to receive the first and second signal groups from the first chip. Degradation of the performance of the semiconductor package, caused by the differences between signal delay times in a plurality of chips therein may be minimized.

Abstract translation: 一种半导体封装，包括被配置为从所述半导体封装的外部接收第一信号组的第一连接端子组，被配置为向外部发送第二信号组的第二连接端子组，连接到所述第一连接端子组的第一芯片 以及连接到第二连接端子组并被配置为从第一芯片接收第一和第二信号组的第二芯片。 由于其中的多个芯片中的信号延迟时间之间的差异引起的半导体封装的性能的降低可能被最小化。