公开(公告)号：US20230223695A1

公开(公告)日：2023-07-13

申请号：US18173337

申请日：2023-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin YUN ,  Soonheung KWON ,  Hosaeng KIM ,  Hyungjoo LEE

IPC: H01Q9/04 ,  H01Q1/24

CPC classification number: H01Q9/0407 ,  H01Q1/243

Abstract: An electronic device is provided. The electronic device includes a first conductive patch, a second conductive patch, a third conductive patch, and a wireless communication circuit. The first conductive patch includes a first edge facing the second conductive patch, a second edge perpendicularly meeting the first edge at a first corner, a third edge parallel to the first edge, and a fourth edge that is parallel to the second edge and perpendicularly meets the third edge at a second corner. The second conductive patch and the third conductive patch each have a shape identical to that of the first conductive patch. The wireless communication circuit feed power to a first point of the first edge, a second point of a fifth edge of the second conductive patch, and a third point of a sixth edge of the third conductive patch.

公开(公告)号：US20230089687A1

公开(公告)日：2023-03-23

申请号：US17955770

申请日：2022-09-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonheung KWON ,  Sumin YUN ,  Hosaeng KIM ,  Hyunjeong LEE ,  Hyungjoo LEE

IPC: H01Q1/24 ,  H01Q5/25 ,  H01Q1/48 ,  H01Q9/04 ,  H01Q5/307

Abstract: An electronic device includes a housing providing a front surface and a rear surface, an antenna including a printed circuit board within the housing and including a first surface facing the front surface and a second surface facing the rear surface. The printed circuit board includes a first conductive layer including a first antenna element and a second antenna element that do not overlap each other when viewed from above the first surface, a second conductive layer operating as a ground plane, and a dielectric between the first and second conductive layers. A conductive pattern is located between the front surface and the second surface when the first surface faces the rear surface and is located between the rear surface and the second surface when the first surface faces the front surface. The conductive pattern overlaps a part of the second conductive layer when viewed from above the first surface.

公开(公告)号：US20240079762A1

公开(公告)日：2024-03-07

申请号：US18484059

申请日：2023-10-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyungjoo LEE ,  Soonheung KWON ,  Hosaeng KIM ,  Sumin YUN

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q21/24 ,  H04M1/02

CPC classification number: H01Q1/243 ,  H01Q9/045 ,  H01Q21/24 ,  H04M1/026

Abstract: An electronic device is provided. The electronic device includes a housing including a lateral member, a printed circuit board disposed inside the housing and including a first ground point and a second ground point electrically connected to a first point and a second point of a first conductive part of the lateral member, a first antenna including a first feeding point disposed between the first point and the second point, and configured to transmit and/or receive a first polarization signal, a patch antenna including a first feeder point and configured to transmit and/or receive a first polarization signal, a wireless communication module electrically connected to the first feeding point and the first feeder point, and a processor electrically connected to the wireless communication module and configured to transmit and/or receive the first polarization signal by using the patch antenna and the first antenna.

公开(公告)号：US20200313715A1

公开(公告)日：2020-10-01

申请号：US16321413

申请日：2017-07-13

Applicant: Samsung Electronics Co., Ltd

Inventor： Hyangbok LEE ,  Byoung-Ryoul SONG ,  Taelee LEE ,  Soonheung KWON ,  Min-Seok KIM ,  Won-Seob KIM ,  Yoon-Goo NAM ,  Sung-Soo KIM ,  Sigwan KIM ,  Seung-Hwa SHIN ,  Taekkyun CHOI ,  Young HEO

IPC: H04B1/401 ,  H04B7/0404

Abstract: Various examples of the present invention relate to a device and a method for improving wireless communication performance in an electronic device. The electronic device comprises multiple antennas, a communication circuit connected to the multiple antennas, a connector, and at least one processor, wherein the processor checks whether a wired cable is connected through the connector and, if the wired cable is connected through the connector, can perform control such that communication using the multiple antennas corresponding to the connection of the wired cable is performed. Other examples can be possible.

公开(公告)号：US20240106125A1

公开(公告)日：2024-03-28

申请号：US18514723

申请日：2023-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonheung KWON ,  Hosaeng KIM ,  Ahyun SHIN ,  Sumin YUN ,  Hyungjoo LEE

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/48 ,  H01Q5/10

CPC classification number: H01Q9/0407 ,  H01Q1/243 ,  H01Q1/48 ,  H01Q5/10

Abstract: An electronic device includes a substrate including a ground layer; and a plurality of antenna structures space apart from each other on the substrate. Each of the plurality of antenna structures may include, on the substrate: a rectangular first conductive patch including a pair of cutting portions in which diagonally opposite corners are cut; a rectangular second conductive patch disposed so as to be coupled to the first conductive patch; and a plurality of conductive pads which are disposed along the periphery of the second conductive patch so as to be spaced apart from each other at a specified interval, and are electrically connected to the ground layer.

公开(公告)号：US20230361483A1

公开(公告)日：2023-11-09

申请号：US18327502

申请日：2023-06-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sumin YUN ,  Soonheung KWON ,  Hosaeng KIM ,  Hyungjoo LEE

IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q1/24

CPC classification number: H01Q21/065 ,  H01Q9/0435 ,  H01Q1/241

Abstract: According to an example embodiment of the disclosure, an electronic device may include: an antenna array comprising a plurality of antenna elements; a wireless communication circuit configured to perform communication with a signal source outside of the electronic device through the antenna array in an ultra-wideband (UWB); and a processor electrically connected to the wireless communication circuit, wherein the wireless communication circuit is configured to simultaneously radiate a first linearly polarized wave through a first antenna element among the plurality of antenna elements and a second linearly polarized wave through a second antenna element among the plurality of antenna elements, wherein an electric field of the first linearly polarized wave oscillates in a first direction, and wherein an electric field of the second linearly polarized wave oscillates in a second direction at an acute angle with respect to the first direction, and wherein the processor is configured to perform a positioning function with respect to the signal source based on a difference between arrival times of signals received from the signal source through the first and second antenna elements.