公开(公告)号：US20210118886A1

公开(公告)日：2021-04-22

申请号：US16887297

申请日：2020-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jay-Bok CHOI ,  Su Ji AHN ,  Yong Seok AHN ,  Seung Hyung LEE

IPC: H01L27/108 ,  G11C5/06 ,  H01L29/06

Abstract: A semiconductor device includes a substrate having a cell region, a boundary region, a peripheral region sequentially arranged in a first direction, an active pattern extending in the cell region in a second direction forming a first acute angle with respect to the first direction, and a boundary pattern in the cell region and directly adjacent to the boundary region. The boundary pattern includes a first side surface extending in the second direction and a first boundary surface extending in a third direction, which is perpendicular to the first direction, from the first side surface, and the first boundary surface defines a boundary between the cell region and the boundary region.