公开(公告)号：US20250022995A1

公开(公告)日：2025-01-16

申请号：US18772193

申请日：2024-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ilseop Won ,  Changhoon Kwak ,  Chulsoo Yoon ,  DONGSOO LEE ,  Seunggyun Jung ,  Sujong Han

IPC: H01L33/60 ,  H01L25/075 ,  H01L33/62

Abstract: A light-emitting device package includes a circuit board, a light-emitting device mounted on the circuit board, a reflective sheet disposed on the circuit board, the reflective sheet including an opening penetrating through the reflective sheet, wherein the light-emitting device is disposed within the opening, an inclined portion surrounding the opening when viewed in a plan view, and being inclined at a first angle with respect to an upper surface of the circuit board, and a flat extension portion surrounding the inclined portion when viewed in a plan view, and being parallel to the upper surface of the circuit board, and a diffuser plate disposed at a first vertical distance from the upper surface of the circuit board. An air gap is disposed between the upper surface of the circuit board and the flat extension portion.