公开(公告)号：US10699991B2

公开(公告)日：2020-06-30

申请号：US15841937

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi-Goo Kang ,  Sun-Woo Kim ,  Jong-Sup Song ,  Ho-Young Song

IPC: H01L23/495 ,  H01L33/44 ,  H01L23/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62 ,  H01L23/48

Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.