公开(公告)号：US10699991B2

公开(公告)日：2020-06-30

申请号：US15841937

申请日：2017-12-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chi-Goo Kang ,  Sun-Woo Kim ,  Jong-Sup Song ,  Ho-Young Song

IPC: H01L23/495 ,  H01L33/44 ,  H01L23/00 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62 ,  H01L23/48

Abstract: A packaged light emitting device can include a mounting substrate including first and second electrode portions that are separated by a recess defined by a first side surface of the first electrode portion and a second side surface of the second electrode portion that is opposite the first side surface. An insulation support member can partially fill a lower portion of the recess to partially cover the first side surface and partially cover the second side surface. A light emitting device can be coupled to the first and second electrode portions of the mounting substrate and a sealing member can be on the mounting substrate covering the light emitting device.

公开(公告)号：US09477032B2

公开(公告)日：2016-10-25

申请号：US14469097

申请日：2014-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-Sup Song ,  Sung-Soo Park

IPC: F21V8/00 ,  H05K1/02 ,  H05K1/11 ,  H01L33/48 ,  H05K1/03 ,  G02F1/1335 ,  H01L33/56 ,  H01L33/62 ,  H01L33/54

CPC classification number: G02B6/0073 ,  G02B6/0051 ,  G02B6/0053 ,  G02B6/0068 ,  G02F1/133603 ,  G02F2001/133607 ,  G02F2001/133614 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/73253 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/10106

Abstract: A substrate for packaging flip-chip light emitting device (LED) includes a substrate including a chip mount region, a first metal pattern overlapping a part of the chip mount region and disposed on the substrate, a second metal pattern disposed in a region including the chip mount region that is not overlapped with the first metal pattern, at an outer side of the first metal pattern, a third metal pattern disposed at an outer side of the second metal pattern, a first isolation line defined in a boundary between the first metal pattern and the second metal pattern, a second isolation line defined in a boundary between the second metal pattern and the third metal pattern, a lower pad disposed on a bottom of the substrate, and a via disposed to connect the first and second metal patterns to the lower pad in the substrate.

Abstract translation: 一种用于封装倒装芯片发光器件（LED）的衬底包括：衬底，其包括芯片安装区域，与芯片安装区域的一部分重叠并且设置在衬底上的第一金属图案;第二金属图案，设置在包括 芯片安装区域，其不与第一金属图案重叠，在第一金属图案的外侧，设置在第二金属图案的外侧的第三金属图案，限定在第一金属 图案和第二金属图案，限定在第二金属图案和第三金属图案之间的边界中的第二隔离线，设置在基板的底部上的下垫，以及布置成将第一和第二金属图案连接到 衬底中的下垫。