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公开(公告)号：US11380636B2
公开(公告)日：2022-07-05
申请号：US16293239
申请日：2019-03-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung Min Baek , Yoon Su Kim , Seok Il Hong , Byung Lyul Park , Sung Han
IPC: H01L23/00
Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.
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公开(公告)号：US11011485B2
公开(公告)日：2021-05-18
申请号：US16294083
申请日：2019-03-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Hoon Choi , Doo Hwan Lee , Joo Young Choi , Sung Han , Byung Ho Kim
IPC: H01L23/31 , H01L23/498 , H01L23/13 , H01L23/00
Abstract: A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.
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公开(公告)号：US20200091099A1
公开(公告)日：2020-03-19
申请号：US16294083
申请日：2019-03-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Hoon Choi , Doo Hwan Lee , Joo Young Choi , Sung Han , Byung Ho Kim
IPC: H01L23/00 , H01L23/31 , H01L23/498 , H01L23/13
Abstract: A semiconductor package includes: a semiconductor chip including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening; an encapsulant covering at least a portion of the semiconductor chip; and the connection structure including an insulating layer having a via hole connected to the second opening to expose at least a portion of the connection pad, a redistribution layer, and a connection via connecting the connection pad to the redistribution layer while filling at least a portion of each of the via hole and the second opening. The second opening and the via hole are connected to have a stepped portion.
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公开(公告)号：US10519584B2
公开(公告)日：2019-12-31
申请号：US15436627
申请日：2017-02-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyu-sung Na , Min-sung Kim , Sung Han , Jeong-hoon Kang
Abstract: A vibration damper and a washing machine including the same are disclosed. The vibration damper includes a tappet, a supporting rod slidably coupled to the tappet, a friction unit disposed inside the tappet and configured to rub the supporting rod, and a cap coupled to one end of the tappet and including a plurality of supporting blocks. The plurality of supporting blocks support an outer circumference of the supporting rod with non-uniform bearing power.
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公开(公告)号：US12113410B2
公开(公告)日：2024-10-08
申请号：US17808462
申请日：2022-06-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Minsung Kim , Kwanwoo Hong , Jeonghoon Kang , Sung Han
CPC classification number: H02K15/165 , H02K7/16
Abstract: A method of manufacturing a motor assembly comprising a motor and an impeller coupled to a rotation shaft of the motor, the method includes disposing a plurality of balls in a ring-shaped groove formed in a surface of the impeller; rotating the impeller at a speed greater than a resonant rotation speed to move the balls to a compensation position for compensating for an eccentricity in the motor assembly; and fixing the balls at the compensation position in the groove.
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Patent Agency Ranking
公开(公告)号：US11476215B2
公开(公告)日：2022-10-18
申请号：US17243889
申请日：2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Hoon Choi , Doo Hwan Lee , Joo Young Choi , Sung Han , Byung Ho Kim
IPC: H01L23/00 , H01L23/31 , H01L23/498 , H01L23/13 , H01L23/538
Abstract: A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.
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公开(公告)号：US11618991B2
公开(公告)日：2023-04-04
申请号：US16937003
申请日：2020-07-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dongwoo Shin , Hooijoong Kim , Minsung Kim , Jinbaek Kim , Hyunjoo Kim , Geonung Lee , Hwangmook Cho , Sung Han
Abstract: A clothes care apparatus including: a main body including a clothes care room; a blower configured to form an airflow inside the clothes care room formed therein, and disposed between an upper part of the clothes care room and an upper part of the main body; and a duct configured to allow air inside the clothes care room to be introduced into the blower by the blower, and formed between a rear part of the main body and a rear part of the clothes care room, wherein the blower includes a blowing fan and a scroll to cover the blowing fan, and the scroll includes a flat portion formed to extend in a direction corresponding to an extension direction of the duct to guide the air into the blower.
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公开(公告)号：US20200083184A1
公开(公告)日：2020-03-12
申请号：US16293239
申请日：2019-03-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seung Min Baek , Yoon Su Kim , Seok Il Hong , Byung Lyul Park , Sung Han
IPC: H01L23/00
Abstract: A semiconductor package includes a semiconductor chip, and including a passivation film disposed on an active surface and having a first opening exposing at least a portion of a connection pad of the semiconductor chip and a protective film disposed on the passivation film, filling at least a portion in the first opening, and having a second opening exposing at least a portion of the connection pad in the first opening, an encapsulant covering at least a portion of the semiconductor chip, and a connection structure disposed on the active surface of the semiconductor chip, and including a connection via connected to the connection pad in the first opening and the second opening and a redistribution layer electrically connected to the connection pad through the connection via. The second opening has a width narrower than a width of the first opening.
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公开(公告)号：US20210265296A1
公开(公告)日：2021-08-26
申请号：US17243889
申请日：2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae Hoon Choi , Doo Hwan Lee , Joo Young Choi , Sung Han , Byung Ho Kim
IPC: H01L23/00 , H01L23/31 , H01L23/498 , H01L23/13
Abstract: A method of manufacturing a semiconductor package is provided and includes forming a protective layer on a passivation layer and a connection pad of a semiconductor chip exposed by a first opening of the passivation layer, forming an insulating layer on the protective layer, forming a via hole penetrating the insulating layer to expose the protective layer, forming a second opening by removing a portion of the protective layer through the via hole, and forming a connection via filling the via hole and the second opening and a redistribution layer on the connection via. The second opening and the via hole are connected to have a stepped portion. The first opening has a width narrower closer to the connection pad, and the second opening has a width wider closer to the connection pad.
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公开(公告)号：US20170292215A1
公开(公告)日：2017-10-12
申请号：US15436627
申请日：2017-02-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Gyu-sung Na , Min-sung Kim , Sung Han , Jeong-hoon Kang
Abstract: A vibration damper and a washing machine including the same are disclosed. The vibration damper includes a tappet, a supporting rod slidably coupled to the tappet, a friction unit disposed inside the tappet and configured to rub the supporting rod, and a cap coupled to one end of the tappet and including a plurality of supporting blocks. The plurality of supporting blocks support an outer circumference of the supporting rod with non-uniform bearing power.
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