公开(公告)号：US12282317B2

公开(公告)日：2025-04-22

申请号：US17680958

申请日：2022-02-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung Hee Lee ,  Jae Yoon Kim ,  Jung Hwan Moon ,  Jung Hoon Bak ,  Kyu-Baik Chang ,  Jae Hoon Jeong ,  Min Kyoung Joo

IPC: G05B19/418 ,  G06N5/02

Abstract: A wafer defect test apparatus in which a defect prediction performance is improved and a simulation time is shortened is provided. The wafer defect test apparatus comprises a wafer variable generator which receives a first structural measurement data and a first process condition data of a first wafer, and a second structural measurement data and a second process condition data of a second wafer, generates a first process variable and a second process variable based on the first structural measurement data and the first process condition data, and generates a third process variable and a fourth process variable based on the second structural measurement data and the second process condition data, an abnormal wafer index generating circuit which generates a first wafer vector of the first process variable and second process variable, generates a second wafer vector of the third process variable and fourth process variable, calculates a first Euclidean distance between the first wafer vector and the second wafer vector, calculates a first Cosine distance between the first wafer vector and the second wafer vector, and generates a first abnormal wafer index of the first wafer based on a product of the first Euclidean distance and the first Cosine distance, and a prediction model generating circuit which receives a first characteristic variable which is a test result of the first wafer, and generates a wafer defect prediction model through a regression based on the first process variable, the second process variable, the first characteristic variable, and the first abnormal wafer index.

公开(公告)号：US10334529B2

公开(公告)日：2019-06-25

申请号：US15050999

申请日：2016-02-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung Hee Lee

IPC: H04W52/02 ,  H04W84/18

Abstract: An electronic device and a power saving method of an electronic device forming an ad-hoc network are provided. The electronic device includes a communication circuit configured to transmit a beacon frame defining a beacon interval to an external device forming an ad-hoc network with the electronic device; and a processor configured to determine a state of the communication circuit during the beacon interval based on whether an announcement traffic indication message (ATIM) frame is transceived between the electronic device and the external electronic device. The method includes receiving power saving mode support information indicating whether to support a power saving mode function, from at least one external device; and activating or deactivating the power saving mode function of the electronic device based on the power saving mode support information.

公开(公告)号：US11088742B2

公开(公告)日：2021-08-10

申请号：US15733189

申请日：2018-07-27

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyun Kee Min ,  Sun Key Lee ,  Jung Hun Lee ,  Tae Hun Lim ,  Min Whoa Hong ,  Choun Jong Nam ,  Sung Hee Lee

IPC: H04B7/06

Abstract: Disclosed is an electronic device comprising: a touch screen display; a battery; a plurality of antenna elements arranged in order to perform beamforming for directional wireless communication; a first wireless communication circuit configured to provide, through the antenna elements, first wireless communication having a first coverage; a second wireless communication circuit configured to provide second wireless communication having a second coverage greater than the first coverage; and a processor connected to the display, the battery, the first wireless communication circuit, and the second wireless communication circuit, wherein the processor stores instructions for determining whether an external device is close to the electronic device by using the first wireless communication circuit, enabling at least one antenna element, rather than all the antenna elements, among the plurality of antenna elements, and transmitting data to the external device by using the second wireless communication circuit and the enabled at least one antenna element.

公开(公告)号：US10856442B2

公开(公告)日：2020-12-01

申请号：US15298437

申请日：2016-10-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kwang Ho Choi ,  Wang Byung Chae ,  Tae Woo Kang ,  Kyo Seung Kim ,  Hyeon U Park ,  Ji-Ho Baek ,  Sung Hee Lee ,  Youn Sang Jang ,  Tae Sung Choi ,  Seung Ho Hong

IPC: H05K7/20 ,  F24F1/24 ,  B23P15/26

Abstract: An outdoor unit of an air conditioner having an improved structure to efficiently cool a heating unit of electronic parts therein, a cooling unit applied to the outdoor unit, and a method for manufacturing the cooling unit are provided. The outdoor unit of an air conditioner includes a case, a compressor for compressing a refrigerant, a condenser for condensing a refrigerant discharged from the compressor, electronic parts arranged in the case; and a cooling unit arranged to cool the electronic parts, wherein the cooling unit comprises a heat radiation member arranged to receive and cool down heat produced from the electronic parts, and to come into contact with at least a part of a cooling pipe in which the refrigerant flows, and a plurality of heat transfer fins formed at least some part of the heat radiation member.