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公开(公告)号：US10607971B2
公开(公告)日：2020-03-31
申请号：US15968143
申请日：2018-05-01
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yun Hyeok Im , Hee Seok Lee , Tae Woo Kang , Yeong Seok Kim , Kyoung-Min Lee
IPC: H01L23/34 , H01L25/10 , H01L23/367 , H01L23/538 , H01L23/498
Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
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公开(公告)号：US11171128B2
公开(公告)日：2021-11-09
申请号：US16827936
申请日：2020-03-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yun Hyeok Im , Hee Seok Lee , Tae Woo Kang , Yeong Seok Kim , Kyoung-Min Lee
IPC: H01L23/34 , H01L25/10 , H01L23/367 , H01L23/538 , H01L23/498
Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
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Patent Agency Ranking
公开(公告)号：US20160091425A1
公开(公告)日：2016-03-31
申请号：US14860440
申请日：2015-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Woo Kang , Han Suk Lee , Wang Byung Chae
Abstract: Provided are an outdoor unit of an air conditioner that detects snow that piles up on the outdoor unit of the air conditioner and a method of controlling the same. When a detection device is installed in the outdoor unit and snow piles up in a snow cover detection area included in the detection device, it is detected using an optical sensor whether snow cover occurs. A value detected by the optical sensor is transmitted to a controller, and the controller compares the value with a default value, and when the controller receives a value different from the default value, the controller controls a fan driving unit to drive a fan. Wind generated by driving the fan removes snow that piles up in the snow cover detection area, a fan guard and a discharge port to prevent the fan from malfunctioning due to accumulated snow.
Abstract translation: 本发明提供一种能够检测在空调机的室外机上积雪的空气调节机的室外机及其控制方法。 当检测装置安装在室外机中并且积雪堆积在包括在检测装置中的积雪检测区域中时，使用光学传感器检测是否发生积雪。 由光学传感器检测到的值被发送到控制器，并且控制器将该值与默认值进行比较，并且当控制器接收到与默认值不同的值时，控制器控制风扇驱动单元驱动风扇。 通过驱动风扇产生的风将雪堆检测区域积雪，风扇护罩和排放口排除，以防止风雪由于积雪而发生故障。
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公开(公告)号：US10801741B2
公开(公告)日：2020-10-13
申请号：US15765657
申请日：2016-10-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Tae Il Kim , Mun Sub Kim , Tae Woo Kang , Hyeon U Park , Wang Byung Chae , Kyung Hoon Kim , Sung Goo Kim , Hyeong Joon Seo , Hyun Wuk Kang , Jin Yong Mo , Il Yong Cho
IPC: F24F1/28 , F25B41/04 , F24F11/89 , F25B13/00 , F25B41/00 , F24F1/06 , F24F1/00 , F25B41/06 , F25B43/00 , F25B1/00
Abstract: In an air-conditioning system, a gaseous refrigerant remaining in a reservoir can be discharged from the reservoir even when a cooling operation has started and the reservoir is being filled with a liquid refrigerant. Therefore, the reservoir can be filled with the liquid refrigerant at a faster speed.
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公开(公告)号：US09574999B2
公开(公告)日：2017-02-21
申请号：US14860440
申请日：2015-09-21
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tae Woo Kang , Han Suk Lee , Wang Byung Chae
Abstract: Provided are an outdoor unit of an air conditioner that detects snow that piles up on the outdoor unit of the air conditioner and a method of controlling the same. When a detection device is installed in the outdoor unit and snow piles up in a snow cover detection area included in the detection device, it is detected using an optical sensor whether snow cover occurs. A value detected by the optical sensor is transmitted to a controller, and the controller compares the value with a default value, and when the controller receives a value different from the default value, the controller controls a fan driving unit to drive a fan. Wind generated by driving the fan removes snow that piles up in the snow cover detection area, a fan guard and a discharge port to prevent the fan from malfunctioning due to accumulated snow.
Abstract translation: 本发明提供一种能够检测在空调机的室外机上积雪的空气调节机的室外机及其控制方法。 当检测装置安装在室外机中并且积雪堆积在包括在检测装置中的积雪检测区域中时，使用光学传感器检测是否发生积雪。 由光学传感器检测到的值被发送到控制器，并且控制器将该值与默认值进行比较，并且当控制器接收到与默认值不同的值时，控制器控制风扇驱动单元驱动风扇。 通过驱动风扇产生的风将雪堆检测区域积雪，风扇护罩和排放口排除，以防止风雪由于积雪而发生故障。
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公开(公告)号：US10856442B2
公开(公告)日：2020-12-01
申请号：US15298437
申请日：2016-10-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kwang Ho Choi , Wang Byung Chae , Tae Woo Kang , Kyo Seung Kim , Hyeon U Park , Ji-Ho Baek , Sung Hee Lee , Youn Sang Jang , Tae Sung Choi , Seung Ho Hong
Abstract: An outdoor unit of an air conditioner having an improved structure to efficiently cool a heating unit of electronic parts therein, a cooling unit applied to the outdoor unit, and a method for manufacturing the cooling unit are provided. The outdoor unit of an air conditioner includes a case, a compressor for compressing a refrigerant, a condenser for condensing a refrigerant discharged from the compressor, electronic parts arranged in the case; and a cooling unit arranged to cool the electronic parts, wherein the cooling unit comprises a heat radiation member arranged to receive and cool down heat produced from the electronic parts, and to come into contact with at least a part of a cooling pipe in which the refrigerant flows, and a plurality of heat transfer fins formed at least some part of the heat radiation member.
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公开(公告)号：US20200219860A1
公开(公告)日：2020-07-09
申请号：US16827936
申请日：2020-03-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yun Hyeok Im , Hee Seok Lee , Tae Woo Kang , Yeong Seok Kim , Kyoung-Min Lee
IPC: H01L25/10 , H01L23/367 , H01L23/538 , H01L23/498
Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.
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