公开(公告)号：US20230305055A1

公开(公告)日：2023-09-28

申请号：US18164256

申请日：2023-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumsuk Chung ,  Hyungseok Kang ,  Kyewan Park ,  Sungbo Shim ,  Sanghyun Ahn ,  Inkap Chang ,  Minho Jeong

IPC: G01R31/28

CPC classification number: G01R31/2896

Abstract: A method of testing a semiconductor device includes obtaining first data generated by testing wafers, each including a plurality of chips, the obtaining based on a plurality of first items, obtaining second data generated by testing packages, each including a packaged chip, the obtaining based on a plurality of second items, detecting correlations between the plurality of first items and the plurality of second items, based on the first data and the second data, identifying at least one first item affecting variation of the packages, based on the correlations, and testing the identified at least one first item.