公开(公告)号：US11668743B2

公开(公告)日：2023-06-06

申请号：US17469169

申请日：2021-09-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hakgyun Kim ,  Bumsuk Chung

IPC: G01R31/02 ,  G01R31/26 ,  G01R31/28 ,  H01L21/66

CPC classification number: G01R31/2642 ,  G01R31/2648 ,  G01R31/2831 ,  G01R31/2884 ,  G01R31/2886 ,  H01L22/34 ,  H01L2924/00 ,  H01L2924/0002

Abstract: A method of analyzing defects in a semiconductor device includes: collecting current data by applying a test voltage to the semiconductor device; extracting data within a decrease range from the current data; dividing the current data into a first component value and a second component value using the current data and the data extracted from within the decrease range; calculating a first quality index from the first component value satisfying a first function; and calculating a second quality index from the second component value satisfying a second function that is different from the first function.

公开(公告)号：US12111879B2

公开(公告)日：2024-10-08

申请号：US17366180

申请日：2021-07-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hakgyun Kim ,  Bumsuk Chung

IPC: G06F17/18 ,  G06F17/15 ,  H01L21/66

CPC classification number: G06F17/18 ,  G06F17/15 ,  H01L22/12 ,  H01L22/20

Abstract: An operating method for a distribution output device includes; generating data number sets for data groups, grouping defect times according to an order in which the corresponding defects occurred in relation to each of the data number sets, calculating likelihood summations respectively corresponding to the data number sets in relation to defect times grouped in accordance with the data number sets, determining a maximum likelihood summation among the likelihood summations, determining optimal population parameter data for each of the data groups in relation to the maximum likelihood summation, and outputting a Weibull distribution for each of the data groups in relation to the optimal population parameter data for each of the data groups.

公开(公告)号：US20230305055A1

公开(公告)日：2023-09-28

申请号：US18164256

申请日：2023-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Bumsuk Chung ,  Hyungseok Kang ,  Kyewan Park ,  Sungbo Shim ,  Sanghyun Ahn ,  Inkap Chang ,  Minho Jeong

IPC: G01R31/28

CPC classification number: G01R31/2896

Abstract: A method of testing a semiconductor device includes obtaining first data generated by testing wafers, each including a plurality of chips, the obtaining based on a plurality of first items, obtaining second data generated by testing packages, each including a packaged chip, the obtaining based on a plurality of second items, detecting correlations between the plurality of first items and the plurality of second items, based on the first data and the second data, identifying at least one first item affecting variation of the packages, based on the correlations, and testing the identified at least one first item.