中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

55 records (took 0.023 seconds)

    Acoustic device and electronic device including the same
    2.
    发明授权
    Acoustic device and electronic device including the same 有权

    公开(公告)号：US12155986B2

    公开(公告)日：2024-11-26

    申请号：US17896656

    申请日：2022-08-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Hyeonyeong Jeong ,  Haekeu Park ,  Sungjin Kim ,  Sohee Kim ,  Juhee Chang ,  Seunga Lee

    IPC: H04R1/10 ,  H04R1/08

    Abstract: An acoustic device and an electronic device including the same are provided. The acoustic device and an electronic device include a main body including at least one acoustic output port and at least one air vent port, a speaker unit accommodated in the main body, a first ear tip including at least one first opening area corresponding to the at least one air vent port and detachably coupled to the main body, and a second ear tip including at least one second opening area corresponding to the at least one air vent port and detachably coupled to the main body, wherein one of the first ear tip or the second ear tip may be coupled to the main body so that the main body is worn in a user's ear, and when the first ear tip is mounted, a larger area of the at least one air vent port may be exposed to an external space through the at least one first opening area than when the second ear tip is mounted.

    Vertical semiconductor devices
    4.
    发明授权
    Vertical semiconductor devices 有权

    公开(公告)号：US11430800B2

    公开(公告)日：2022-08-30

    申请号：US16839184

    申请日：2020-04-03

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sunggil Kim ,  Seulye Kim ,  Dongkyum Kim ,  Sungjin Kim ,  Junghwan Kim ,  Chanhyoung Kim ,  Jihoon Choi

    IPC: H01L27/11582 ,  H01L27/11556 ,  H01L27/11519 ,  H01L27/11524 ,  H01L27/11558

    Abstract: A vertical semiconductor device may include a stacked structure, a channel structure and a lower connection structure. The stacked structure may include insulation layers and gate electrodes alternately repeatedly stacked. The stacked structure may be spaced apart from an upper surface of a substrate. The channel structure may include a charge storage structure and a channel. The channel structure may pass through the stacked structure. The lower connection structure may be formed on the substrate. The lower connection structure may be electrically connected with the channel and the substrate. A sidewall of the lower connection structure may include a protrusion disposed at a central portion of the sidewall from the upper surface of the substrate in a vertical direction. The vertical semiconductor device may have a high reliability.

    Electronic device including interposer
    5.
    发明授权
    Electronic device including interposer 有权

    公开(公告)号：US11317512B2

    公开(公告)日：2022-04-26

    申请号：US16883604

    申请日：2020-05-26

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Sangwon Ha ,  Seyoung Jang ,  Sungjin Kim ,  Sanghoon Park ,  Kyungho Lee ,  Younoh Chi

    IPC: H05K1/14 ,  H01L25/065

    Abstract: An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, wherein the first electronic component on the first circuit board is disposed corresponding to the first region, and the second electronic component on the first circuit board is disposed corresponding to the second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.

    System and method for providing conversational contents
    6.
    发明授权
    System and method for providing conversational contents 有权

    公开(公告)号：US10911378B2

    公开(公告)日：2021-02-02

    申请号：US16270954

    申请日：2019-02-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Sungjin Kim ,  Yongsuk Kwon ,  Myeongcheol Kim ,  Yoonsung Nam ,  Hyongjin Ban ,  Sangsoo Lee

    IPC: G06F15/16 ,  H04L12/58

    Abstract: An electronic device may be configured to receive a message for a second external electronic device, from a first external electronic device through a first network associated with the first external electronic device among a plurality of rich communication suite (RCS) networks using a communication circuit, to determine whether to transmit the message based on a profile of the second external electronic device including at least one throttling metric for the first network among the plurality of RCS networks stored in a memory and a network state of the first network, and to convert the message based on a protocol of a second network and to transmit the converted message to the second external electronic device through the second network based on determining to transmit the message.

    Semiconductor device
    7.
    发明授权
    Semiconductor device 有权

    公开(公告)号：US10679957B2

    公开(公告)日：2020-06-09

    申请号：US16140252

    申请日：2018-09-24

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Seok-Ho Shin ,  Bonhwi Gu ,  Hyekyeong Kweon ,  Sungjin Kim ,  Joodong Kim ,  Jaepil Lee ,  Dongwon Lim

    IPC: H01L23/48 ,  H01L23/00 ,  H01L21/66 ,  H01L23/522 ,  H01L23/535 ,  H01L23/532

    Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a plurality of connection structures provided in a lower insulating layer of the edge region and arranged at first intervals in a first direction, an upper insulating layer covering the connection structures, and a plurality of redistribution pads disposed on the upper insulating layer and connected to the connection structures, respectively. Each of the redistribution pads includes a pad portion provided on the chip region. The pad portions of the redistribution pads are spaced apart from the connection structures by a first distance in a second direction intersecting the first direction when viewed in a plan view.

    Semiconductor device
    8.
    发明授权
    Semiconductor device 有权

    公开(公告)号：US10665557B2

    公开(公告)日：2020-05-26

    申请号：US15997338

    申请日：2018-06-04

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jung-Hoon Han ,  Sungjin Kim ,  Junyong Noh ,  Heonjun Lim

    IPC: H01L23/00 ,  H01L23/58 ,  H01L21/66 ,  H01L21/78 ,  H01L23/31 ,  H01L21/683

    Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a lower dielectric layer on the semiconductor substrate, a chip pad on the lower dielectric layer of the chip region, an upper dielectric layer on the lower dielectric layer, which includes a first opening exposing the chip pad on the chip region and a second opening exposing the lower dielectric layer on the edge region, and a redistribution pad connected to the chip pad. The redistribution pad includes a via portion in the first opening and a pad portion extending from the via portion onto the upper dielectric layer.

    Random perturbation-based beamforming method and apparatus for use in mobile communication system
    9.
    发明授权
    Random perturbation-based beamforming method and apparatus for use in mobile communication system 有权
    基于随机扰动的波束成形方法和装置，用于移动通信系统

    公开(公告)号：US09577343B2

    公开(公告)日：2017-02-21

    申请号：US14142618

    申请日：2013-12-27

    Applicant: Samsung Electronics Co., Ltd ,  KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY

    Inventor： Jeongho Park ,  Jiyun Seol ,  Yonghoon Lee ,  Minhyun Kim ,  Sungjin Kim ,  Uitae Hwang

    IPC: H04B10/524 ,  H01Q15/14 ,  H01Q25/00 ,  H01Q5/42

    CPC classification number: H01Q15/14 ,  H01Q5/42 ,  H01Q25/00

    Abstract: A method and apparatus configures a beamforming coefficient based on the signal strength information without collecting channel information by adjusting the phase of the antennas through random perturbation. An antenna control method of a base station in a wireless communication system using a beamforming technique includes measuring nth received signal strength at nth phase of at least one receive antenna, measuring (n+1)th received signal strength at (n+1)th phase shifted randomly from the nth phase in one of forward and backward directions, and configuring a beamforming coefficient with the phase at which the received signal strength is greatest through comparison of received signal strengths. The random perturbation-based beamforming method and apparatus of the present disclosure is capable of configuring the beamforming coefficient appropriate for the normal cellular environment using a plurality analog array antenna without channel estimation overhead.

    Abstract translation: 方法和装置基于信号强度信息配置波束形成系数，而不通过随机扰动调整天线的相位来收集信道信息。 在使用波束成形技术的无线通信系统中的基站的天线控制方法包括：测量第n个接收天线的第n个相位的第n个接收信号强度，测量第（n + 1）个第（n + 1）个接收信号强度 在正向和反向之一中从第n个相位随机移位，并且通过比较接收信号强度来配置具有接收信号强度最大的相位的波束形成系数。 本公开的基于随机扰动的波束成形方法和装置能够使用多个模拟阵列天线来配置适合于正常蜂窝环境的波束成形系数，而不需要信道估计开销。

Patent Agency Ranking