公开(公告)号：US12209296B2

公开(公告)日：2025-01-28

申请号：US17265962

申请日：2019-08-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae Park ,  Sangjun Park ,  Won Ju ,  Jungsoo Lim

IPC: C22C21/02 ,  B22D21/00 ,  C22C1/03 ,  D06F37/20

Abstract: Provided is an aluminum alloy for die casting. The aluminum alloy includes: 3-10 wt % silicon (Si); 0.1-2.0 wt % magnesium (Mg); 0.01-1.3 wt % iron (Fe); 0.01-2.0 wt % zinc (Zn); 0.01-1.5 wt % copper (Cu); 0.01-0.5 wt % manganese (Mn); 0.01-0.5 wt % chrome (Cr); 0.01˜2.0 wt % lanthanum (La); 0.01˜2.0 wt % cerium (Ce); 0.01˜2.0 wt % strontium (Sr); rest aluminum (Al); and unavoidable impurities. The aluminum alloy is improved in not only corrosion-resistance but also physical properties.

公开(公告)号：US20230366638A1

公开(公告)日：2023-11-16

申请号：US18226631

申请日：2023-07-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangjun Park ,  Sungtae Park ,  Kookjeong Seo ,  Jungsoo Lim ,  Won Ju

IPC: F28F1/12 ,  C22C21/08

CPC classification number: F28F1/12 ,  C22C21/08

Abstract: A heat exchanger includes a plurality of tubes in which a refrigerant flows, heat-exchanger fins provided between the plurality of tubes, and a filler coupling the heat-exchanger fins to the plurality of tubes, wherein each of the plurality of tubes comprises a first aluminum alloy, each of the heat-exchanger fins comprises a second aluminum alloy, the filler comprises a third aluminum alloy, the plurality of tubes have a corrosion potential of −745 mV to −695 mV, the filler has a corrosion potential of −810 mV to −720 mV, and the heat-exchanger fins have a corrosion potential of −810 mV to −740 mV.

公开(公告)号：US11923709B2

公开(公告)日：2024-03-05

申请号：US17551793

申请日：2021-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae Park ,  Minki Kim ,  Kicheol Bae ,  Yongjae Song ,  Hyelim Yun ,  Woosung Jang

IPC: H05K1/11 ,  H01Q7/00 ,  H02J7/00 ,  H02J50/10 ,  H05K1/14 ,  H05K1/18 ,  H05K5/00

CPC classification number: H02J7/0042 ,  H01Q7/00 ,  H02J50/10 ,  H05K1/11 ,  H05K1/144 ,  H05K1/181 ,  H05K5/0086 ,  H05K2201/10734

Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

公开(公告)号：US11498104B2

公开(公告)日：2022-11-15

申请号：US16986174

申请日：2020-08-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungtae Park ,  Myounghun Kim ,  Sangjun Park ,  Won Ju ,  Jungsoo Lim ,  Kookjeong Seo

IPC: B21C23/08 ,  B21C23/00

Abstract: An extrusion apparatus and a method for manufacturing an aluminum capillary tube using the same are provided. The extrusion apparatus includes a container, a housing mold provided on one side of the container and including a plurality of dies formed with a plurality of holes, and a ram pressing an aluminum billet accommodated in the container in a direction from another side to the one side of the container so that the aluminum billet accommodated in the container is extruded into a plurality of aluminum capillary tubes having cross-sectional shapes corresponding to the plurality of holes, and the number of the plurality of holes is determined based on an inner diameter of the container and a diameter of each of the plurality of holes.

公开(公告)号：US11309645B2

公开(公告)日：2022-04-19

申请号：US17061461

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minki Kim ,  Byunghoon Lee ,  Min Park ,  Sungtae Park ,  Jungmin Park ,  Yongjae Song ,  Hongshin Shin ,  Woosung Jang ,  Chulwoo Park ,  Chihyun Cho

IPC: H05K5/00 ,  H01R12/62 ,  H05K1/14

Abstract: An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.