公开(公告)号：US20210247328A1

公开(公告)日：2021-08-12

申请号：US17026494

申请日：2020-09-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kihak NAM ,  Sungyoon RYU ,  Kwangeun KIM ,  Hwiwoo PARK ,  Dayoung YOON ,  Myoungkyu CHOI

IPC: G01N21/95 ,  G01N21/55 ,  H01L21/687

Abstract: According to embodiments, a wafer inspection device is provided. The wafer inspection device includes a porous chuck including a plurality of pores formed all over the porous chuck to allow pressure for fixing a wafer to be applied thereto, a chuck driving device, a back side inspection optical system configured to inspect a portion of a back surface of the wafer, and a position identification optical system, wherein the porous chuck includes a plurality of holes uniformly formed all over the porous chuck to partially expose the back surface of the wafer and a slit exposing the back surface of the wafer and extending in one direction parallel to a top surface of the porous chuck.

公开(公告)号：US20220404395A1

公开(公告)日：2022-12-22

申请号：US17721522

申请日：2022-04-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyoon RYU ,  Seungbum HONG ,  Kwangeun KIM ,  Hoon KIM ,  Jiwon YEOM ,  Seokjung YUN ,  Souk KIM ,  Younghoon SOHN ,  Yusin YANG

IPC: G01R1/067 ,  G01R1/04

Abstract: A test apparatus includes a movable stage to support a sample, tips above the stage that have different shapes and alternately perform profiling and milling on the sample, a tip stage connected to a cantilever coupled to the tips, the tip stage to adjust a position of the cantilever, a position sensor to obtain information about a positional relationship between the tips and the sample, a stage controller to control movements of the stage and the tip stage, based on the information about the positional relationship, and a tip controller to select the tips for performing the profiling or milling and to determine conditions for performing milling, wherein a depth of the sample being processed by the milling in the first direction is controlled based on a relationship between a distance between the tips and the sample and a force between the tips and the sample.

公开(公告)号：US20210140899A1

公开(公告)日：2021-05-13

申请号：US16887284

申请日：2020-05-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jangik PARK ,  Sungyoon RYU ,  Younghoon SOHN ,  Yusin YANG

IPC: G01N21/956 ,  G01N21/95 ,  G01N21/21

Abstract: A substrate inspection device including a light source, a polarizer, first and second compensators, an analyzer, a light splitter configured to receive reflected light reflected by the substrate to split the reflected light into first split light and second split light, a first detector and a second detector configured to detect the first split light and the second split light, respectively, and a controller configured to control the first and second detectors differently from each other, may be provided.