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公开(公告)号:US20230114046A1
公开(公告)日:2023-04-13
申请号:US18079178
申请日:2022-12-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunseok KIM , Sunwoo KIM , Jeongjun OH , Yongsoo CHOI
IPC: H04N23/741 , G06T5/50
Abstract: An electronic device comprises: a plurality of scalers for processing respective images of a plurality of content received from a plurality of sources devices; and a processor configured to change information on whether at least one scaler of the plurality of scalers supports high dynamic range (HDR) when a request for simultaneously displaying the plurality of content is received.
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公开(公告)号:US20210209232A1
公开(公告)日:2021-07-08
申请号:US17059768
申请日:2019-05-03
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Woochul SHIM , Sunwoo KIM , Yongho HWANG
IPC: G06F21/57
Abstract: According to one or more embodiments, an electronic device comprises: a display device; a memory for storing at least one source code and a comparison file including any one of a modification and a vulnerability, in which each of at least one character string included in a patch file corresponding to the at least one source code is classified; and a processor functionally connected to the memory and the display device, wherein the processor can be set to load the at least one source code stored in the memory, compare a character string included in the comparison file corresponding to the at least one source code with a character string included in the source code, and provide, through an output device, at least one piece of information from among pieces of information about whether the identified source code is patched, the probability that the source code is patched, and a vulnerability in the source code, on the basis of the result of the comparison.
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公开(公告)号:US20220416130A1
公开(公告)日:2022-12-29
申请号:US17724758
申请日:2022-04-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Myoungsun HA , Hyunju PARK , Sunwoo KIM , Youngkyung KIM
IPC: H01L33/48 , H01L33/62 , H01L33/50 , H01L25/075
Abstract: A semiconductor light emitting device includes a package body including a concave portion surrounded by sidewalls, a light emitting diode (LED) chip on a mounting surface of the concave portion, a lead frame in the package body and electrically connected to the LED chip, a wavelength conversion layer in the concave portion and surrounding the LED chip, the wavelength conversion layer being surrounded by the sidewalls of the package body and including a wavelength conversion material, and a transparent resin layer on the wavelength conversion layer, the transparent resin layer having first opposite side surfaces exposed through sides of the package body and spaced apart from each other along a first direction parallel to the mounting surface, and second opposite side surfaces contacting an inner surface of the package body and spaced apart from each other in a second direction parallel to the mounting surface.
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公开(公告)号:US20190206591A1
公开(公告)日:2019-07-04
申请号:US16239680
申请日:2019-01-04
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sunwoo KIM , Hyunjung KOH , Jinsub KIM , Dongjin PARK , Woosub BANG , Changhun BAE , Sungki SON , Seungbok LEE , Jin LEE , Junghwa CHOI
Abstract: An optical signal transferring apparatus, an electronic apparatus, and a source device, and methods of operating the same include a signal transfer unit including one or more signal lines transferring a signal between a first apparatus and a second apparatus and one or more power lines transferring power between the first apparatus and the second apparatus; and a first connector connected to the first apparatus, and a second connector connected to the second apparatus, wherein the signal transfer unit is configured to transfer an optical signal to the second apparatus in response to a power-on input of the first apparatus and transfer, to the first apparatus, power and data which are received from the second apparatus in response to detection of the transferred optical signal, respectively, via the one or more power lines and the one or more signal lines.
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