公开(公告)号：US20230094302A1

公开(公告)日：2023-03-30

申请号：US17747412

申请日：2022-05-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sung-Min HWANG ,  Dongsung WOO ,  Tae Gon LEE ,  Bongtae PARK ,  Jae-Joo SHIM ,  Tae-Chul JUNG

IPC: H01L27/11526 ,  H01L27/11556 ,  H01L27/11582 ,  H01L27/11519 ,  H01L27/11565 ,  H01L27/11573

Abstract: A semiconductor device and an electronic system including the same are disclosed. The semiconductor device may include a substrate including a cell array region and a connection region, the cell array region comprising a center region and an outer region; an electrode structure including electrodes and pads; vertical structures on the cell array region and penetrating the electrode structure; and a separation insulating pattern penetrating and dividing an upper electrode, which is one of the electrodes, into at least two portions arranged in a second direction crossing the first direction. The separation insulating pattern comprises a first portion and a second portion, the first portion is between at least some of the central vertical structures, and the second portion is spaced apart from the first portion such that, when viewed in the plan view, the second portion is between at least some of the peripheral vertical structure.