公开(公告)号：US11018045B2

公开(公告)日：2021-05-25

申请号：US15993752

申请日：2018-05-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ji Youn Seo ,  Byung Sun Park ,  Sung Jin Park ,  Ji Woon Im ,  Hyun Seok Lim ,  Byung Ho Chun ,  Yu Seon Kang ,  Hyuk Ho Kwon ,  Tae Yong Eom ,  Dae Hun Choi ,  Dong Hyeop Ha

IPC: H01L21/687 ,  C23C14/50 ,  C23C16/455 ,  H01J37/32 ,  C23C16/458

Abstract: A deposition apparatus for depositing a material on a wafer, the apparatus including a lower shower head; an upper shower head disposed on the lower shower head, the upper shower head facing the lower shower head; and a support structure between the upper shower head and the lower shower head, the wafer being supportable by the support structure, wherein the upper shower head includes upper holes for providing an upper gas onto the wafer, the lower shower head includes lower holes for providing a lower gas onto the wafer, the support structure includes a ring body surrounding the wafer; a plurality of ring support shafts between the ring body and the lower shower head; and a plurality of wafer supports extending inwardly from a lower region of the ring body to support the wafer, and the plurality of wafer supports are spaced apart from one another.

公开(公告)号：US11345998B2

公开(公告)日：2022-05-31

申请号：US15988067

申请日：2018-05-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byung Sun Park ,  Ji Youn Seo ,  Ji Woon Im ,  Hyun Seok Lim ,  Byung Ho Chun ,  Yu Seon Kang ,  Hyuk Ho Kwon ,  Sung Jin Park ,  Tae Yong Eom ,  Dong Hyeop Ha

IPC: C23C16/455 ,  H01J37/32 ,  H01L21/02

Abstract: A deposition apparatus includes an upper shower head and a lower shower head within a process chamber, the upper shower head and the lower shower head facing each other, a support structure between the upper shower head and the lower shower head, the support structure being connected to the lower shower head to support a wafer, and a plasma process region between the wafer supported by the support structure and the lower shower head, wherein the lower shower head includes lower holes to jet a lower gas in a direction of the wafer, wherein the upper shower head includes upper holes to jet an upper gas in a direction of the wafer, and wherein the support structure includes through opening portions to discharge a portion of the lower gas jetted through the lower holes to a space between the support structure and the upper shower head.