Abstract:
A semiconductor device includes a substrate including a resistor region, a plurality of lower patterns in the resistor region, and a resistor line pattern on the plurality of lower patterns and the substrate of the resistor region. The plurality of lower patterns extend in a first direction parallel to a surface of the substrate and are spaced apart from each other in a second direction perpendicular to the first direction and parallel to the surface of the substrate. The resistor line pattern extends in the second direction. The resistor line pattern on the lower patterns has an upper surface and a lower surface protruding in a third direction perpendicular to the surface of the substrate.
Abstract:
An apparatus and a method for switching a Radio Access Technology (RAT) by a User Equipment (UE) in a wireless communication system are provided. The method includes detecting an event indicating that the UE should perform a switching operation from a first RAT to a second RAT different from the first RAT occurs while the UE uses the first RAT determining whether a RAT switching operation criterion is satisfied after detecting that the event occurs and if the RAT switching operation criterion is satisfied, performing the switching operation.
Abstract:
A semiconductor device includes a substrate including a resistor region, a plurality of lower patterns in the resistor region, and a resistor line pattern on the plurality of lower patterns and the substrate of the resistor region. The plurality of lower patterns extend in a first direction parallel to a surface of the substrate and are spaced apart from each other in a second direction perpendicular to the first direction and parallel to the surface of the substrate. The resistor line pattern extends in the second direction. The resistor line pattern on the lower patterns has an upper surface and a lower surface protruding in a third direction perpendicular to the surface of the substrate.
Abstract:
A vertical memory device includes a conductive pattern structure on a first region of a substrate, the conductive pattern structure including a stack of interleaved conductive patterns and insulation layers. A pad structure is disposed on a second region of the substrate adjacent the first region of the substrate wherein edges of the conductive patterns are disposed at spaced apart points along a first direction to provide conductive pads arranged as respective steps in a staircase arrangement. A plurality of channel structures extends through the conductive pattern structure and a plurality of dummy channel structures extends through the pad structure. Respective contact plugs are disposed on the conductive pads. Numbers of the dummy channel structures per unit area passing through the conductive pads vary. Widths of the dummy channel structures passing through the conductive pads may also vary.