公开(公告)号：US20170278745A1

公开(公告)日：2017-09-28

申请号：US15621618

申请日：2017-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-Su Kim ,  Dong-Woon Park ,  Tae-Hoi Park ,  Yong-Kug Bae ,  Tae-Hwan Oh ,  Chang-Hoon Lee ,  Boo-Hyun Ham

IPC: H01L21/768 ,  H01L27/02 ,  G03F7/20 ,  H01L21/8234

CPC classification number: H01L21/76816 ,  G03F7/70633 ,  G03F7/70683 ,  H01L21/28518 ,  H01L21/31144 ,  H01L21/76811 ,  H01L21/76897 ,  H01L21/823437 ,  H01L21/823475 ,  H01L27/0207

Abstract: In a method of fabricating a semiconductor device, a substrate including a circuit area and an overlay mark area is provided. Conductive gate patterns are formed on the substrate in the circuit area such that the overlay mark area is free of the gate patterns, and conductive contact patterns are formed on the substrate between the gate patterns in the circuit area. A mirror pattern is formed on the substrate in the overlay mark area, where the mirror pattern and the contact patterns comprising a same reflective material. Related semiconductor devices, overlay marks, and fabrication methods are also discussed.