公开(公告)号：US09793309B2

公开(公告)日：2017-10-17

申请号：US14606010

申请日：2015-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-rim Seo ,  Yoon-young Choi ,  Kyoung-sei Choi ,  Chang-soo Jin ,  Seung-kon Mok ,  Tae-weon Suh ,  Pyoung-wan Kim

IPC: H01L31/0232 ,  H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14627 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.