公开(公告)号：US09793309B2

公开(公告)日：2017-10-17

申请号：US14606010

申请日：2015-01-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-rim Seo ,  Yoon-young Choi ,  Kyoung-sei Choi ,  Chang-soo Jin ,  Seung-kon Mok ,  Tae-weon Suh ,  Pyoung-wan Kim

IPC: H01L31/0232 ,  H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14627 ,  H01L27/14618 ,  H01L27/1462 ,  H01L27/14623 ,  H01L27/14636 ,  H01L31/0203 ,  H01L2224/13 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided is an image sensor package that includes a transparent protection cover for protecting a plurality of unit pixels each including a microlens. The image sensor package includes a substrate which has a first surface and a second surface that are opposite to each other, and includes a sensor array region including a plurality of unit pixels formed in the first surface and a pad region including a pad arranged in the vicinity of the sensor array region, a plurality of microlenses formed on the plurality of unit pixels, respectively, at least two transparent material layers covering the plurality of microlenses, and a transparent protection cover attached onto the plurality of microlenses with the at least two transparent material layers interposed therebetween.

公开(公告)号：US09837361B2

公开(公告)日：2017-12-05

申请号：US14874609

申请日：2015-10-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byoung-rim Seo ,  Woon-bae Kim ,  Young-doo Jung

IPC: H01L23/52 ,  H01L21/70 ,  H01L23/552 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/60 ,  H05K1/02

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/5225 ,  H01L23/60 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/02372 ,  H01L2224/04105 ,  H01L2224/05025 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/80345 ,  H01L2224/96 ,  H01L2225/06537 ,  H01L2924/3025 ,  H05K1/0218 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor package including a semiconductor chip having an active surface and a non-active surface opposite to the active surface, a ground member disposed on the active surface of the semiconductor chip, and an electromagnetic shielding member passing through the semiconductor chip, electrically connected to the ground member, and covering at least some regions of the non-active surface of the semiconductor chip may be provided.