公开(公告)号：US20240312814A1

公开(公告)日：2024-09-19

申请号：US18673488

申请日：2024-05-24

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Min-Cheng WU ,  Chi-Hung LIAO

IPC分类号： H01L21/67 ,  G01N21/88 ,  G01N21/95 ,  H01L21/673 ,  H01L21/677

CPC分类号： H01L21/67288 ,  G01N21/88 ,  H01L21/67265 ,  H01L21/67356 ,  H01L21/67383 ,  H01L21/67769 ,  G01N21/9501

摘要： A method of operating a processing apparatus is provided. The method includes placing a substrate storage container on a load port. The method includes matching a plurality of positioning holes are on a base board of the substrate storage container with a plurality of positioning pins on a base frame of the load port. The method also includes transferring a substrate from the substrate storage container when the substrate storage container is placed on the base frame.

公开(公告)号：US20240304478A1

公开(公告)日：2024-09-12

申请号：US18666686

申请日：2024-05-16

申请人： APPLIED MATERIALS, INC.

发明人： Nicholas Michael Bergantz ,  Jeffrey Hudgens ,  Doug McAllister ,  Helder Lee

IPC分类号： H01L21/67 ,  H01L21/673

CPC分类号： H01L21/67265 ,  H01L21/67356

摘要： A system includes a factory interface, a load port connected to the factory interface, and a system controller. The system controller is to, responsive to detecting that a container is received at the load port, determine a type of parts for storage at the container. One or more mapping patterns associated with the determined type of parts is identified. A detection system of robot arm(s) of the factory interface is moved according to the identified mapping pattern(s) to detect one or more parts stored by the container. A mapping of the container is determined based on the movement of the robot arm(s). The mapping indicates regions of the container that stores detected parts and a position of each of the detected parts. Based on the mapping, the robot arm(s) either remove a detected part form the container or place an additional part in the container.

公开(公告)号：US11893451B2

公开(公告)日：2024-02-06

申请号：US17292138

申请日：2019-11-15

申请人： NANODREAM CO., LTD.

发明人： Hyun Su Lee

IPC分类号： G06M1/10 ,  G01T1/28 ,  G06T7/00 ,  H01L21/673

CPC分类号： G06M1/101 ,  G01T1/28 ,  G06T7/0004 ,  G06T2207/10116 ,  G06T2207/30148 ,  G06T2207/30242 ,  H01L21/67356

摘要： The present invention relates to a chip counter, which transmits an X-ray beam through a tape reel around which a tape having a plurality of semiconductor chips mounted in a row therein is wound, acquires an image scattered or diffracted by the semiconductor chips, and processes the acquired image, so as to count the number of the semiconductor chips, wherein: the X-ray beam transmitted through the tape reel (1) is sensed by a fluorescent intensifying screen (60); a fluorescent light emitted from the fluorescent intensifying screen (60) according to the sensing of the X-ray beam is captured by a camera (70), so that the number of the semiconductor chips is counted from an image in which the semiconductor chips are displayed by a dotted image; and the camera (70) is protected by an X-ray beam shielding member (100: 110; 120; and 130).

公开(公告)号：US20180130683A1

公开(公告)日：2018-05-10

申请号：US15570188

申请日：2016-04-26

申请人： Nederlandse Organisatie voor toegepast-natuurwetenschappelijk onderzoek TNO

发明人： Rob Jacob Hendriks ,  Daan Anton Van den Ende ,  Edsger Constant Pieter Smits

IPC分类号： H01L21/673 ,  H01L21/677 ,  H01L21/683

CPC分类号： H01L21/67356 ,  H01L21/67751 ,  H01L21/683 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2021/60007 ,  H01L2221/68354 ,  H01L2221/68381 ,  H01L2224/1131 ,  H01L2224/1132 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/7526 ,  H01L2224/75502 ,  H01L2224/75611 ,  H01L2224/7565 ,  H01L2224/75702 ,  H01L2224/75753 ,  H01L2224/75804 ,  H01L2224/75824 ,  H01L2224/759 ,  H01L2224/7598 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81224 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method and apparatus for soldering a chip (1a) to a substrate (3). A chip carrier (8) is provided between a flash lamp (5) and the substrate (3). The chip (1a) is attached to the chip carrier (8) on a side of the chip carrier (8) facing the substrate (3). A solder material (2) is disposed between the chip (1a) and the substrate (3). The flash lamp (5) generates a light pulse (6) for heating the chip (1a). The heating of the chip (1a) causes the chip (1a) to be released from the chip carrier (8) towards the substrate (3). The solder material (2) is at least partially melted by contact with the heated chip (1a) for attaching the chip (1a) to the substrate (3).

公开(公告)号：US09496161B2

公开(公告)日：2016-11-15

申请号：US15050387

申请日：2016-02-22

申请人： INTEL CORPORATION

发明人： John C. Johnson ,  Eric J. Moret ,  Lawrence M. Palanuk ,  Gregory A. Stone

IPC分类号： H01L21/67 ,  H01L21/78 ,  H01L21/673 ,  H01L21/677 ,  H01L21/683 ,  H01L21/687 ,  H05K13/00 ,  H01L21/68

CPC分类号： H01L21/67333 ,  H01L21/67265 ,  H01L21/67309 ,  H01L21/67356 ,  H01L21/67363 ,  H01L21/67383 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67778 ,  H01L21/68 ,  H01L21/6833 ,  H01L21/68764 ,  H01L21/68771 ,  H01L21/78 ,  H05K13/0084

摘要： A method includes identifying a wafer position for a plurality of die on a wafer, storing the wafer position for each of the plurality of die in a database, dicing the wafer into a plurality of singulated die, positioning each of the singulated die in a die position location on a tray, and storing the die position on the tray for each of the singulated die in the database. The database includes information including the wafer position associated with each die position. The tray is transported to a processing tool, and at least one of the plurality of singulated die is removed from the die position on the tray and processed in the processing tool. The processed singulated die is replaced in the same defined location on the tray that the singulated die was positioned in prior to the processing. Other embodiments are described and claimed.

摘要翻译： 一种方法包括识别晶片上的多个管芯的晶片位置，将多个管芯中的每个管芯的晶片位置存储在数据库中，将晶片切割成多个单个管芯，将每个单模管芯定位在管芯中 在托盘上的位置位置，并将模具位置存储在数据库中的每个单个模具的托盘上。 数据库包括包括与每个模具位置相关联的晶片位置的信息。 托盘被运送到处理工具，并且多个分割模具中的至少一个从托盘上的模具位置移除并在处理工具中进行处理。 在处理之前，单独模具位于托盘上的相同的限定位置处理被处理的单个模具。 描述和要求保护其他实施例。

公开(公告)号：US20100089851A1

公开(公告)日：2010-04-15

申请号：US12252292

申请日：2008-10-15

申请人： Michael R. Slaughter ,  Justin L. Lawrence ,  John E. Vannortwick ,  Jamie J. Wanke ,  Christopher E. Casey ,  Michael R. Forbis ,  James R. Stoor

发明人： Michael R. Slaughter ,  Justin L. Lawrence ,  John E. Vannortwick ,  Jamie J. Wanke ,  Christopher E. Casey ,  Michael R. Forbis ,  James R. Stoor

IPC分类号： B25H3/04 ,  B29C45/00 ,  H01L21/677

CPC分类号： H01L21/67356 ,  B29C45/0053 ,  B29C65/561 ,  B29C65/562 ,  B29C66/1222 ,  B29C66/1224 ,  B29C66/534 ,  B29C66/543 ,  H01L21/67369

摘要： Handling devices and methods for handling microelectronic assemblies are disclosed herein. In one embodiment, a frame includes a first end portion, a second end portion that is spaced along a longitudinal axis from the first end portion, a first side portion that couples the first and second end portions, and a second side portion that couples the first and second end portions and is spaced along a lateral axis from the first side portion. An insert is releasably disposed on the frame and includes a plurality of pockets, with individual pockets positioned to releasably receive a respective one of the microelectronic assemblies. A retainer is positioned to secure and release the insert with respect to the frame.

摘要翻译： 本文公开了处理微电子组件的处理装置和方法。 在一个实施例中，框架包括第一端部，沿着纵向轴线与第一端部间隔开的第二端部，耦合第一和第二端部的第一侧部和连接第一端部的第二侧部， 第一和第二端部并且沿着横向轴线与第一侧部分间隔开。 插入件可释放地设置在框架上并且包括多个凹穴，其中单独的凹穴被定位成可释放地接收相应的一个微电子组件。 定位器被定位成相对于框架固定和释放插入件。

公开(公告)号：US20050186122A1

公开(公告)日：2005-08-25

申请号：US10783546

申请日：2004-02-20

申请人： James Mercer ,  John Baker ,  Rudolfo Diaz ,  Scott Bennefeld ,  George Grigorow ,  Mark McElhinny

发明人： James Mercer ,  John Baker ,  Rudolfo Diaz ,  Scott Bennefeld ,  George Grigorow ,  Mark McElhinny

IPC分类号： B01L9/00 ,  B65D21/02 ,  B65D25/10 ,  H01L21/673

CPC分类号： H01L21/67356 ,  B01L9/52 ,  B01L2200/025 ,  B01L2300/0822 ,  B65D21/0219 ,  B65D25/101 ,  H01L21/67333

摘要： A molded container may include a unitary base. The base may include projections designed to secure, support, position, and/or protect one or more objects held in the molded container. The projections may be spaced to allow access to objects held in the base. The projections may include ledges and/or lips. A molded container may include a lid. An inner surface of the lid may have protrusions to hold objects in place in the molded container. Closure portions of the lid may snap securely on the base. A lid may be attached to a base or removable. A separate lid may include guides to facilitate placement of the lid on the base. In an embodiment, a base of a molded container may fit in the lid of the molded container. A lid and/or a base of a molded container may be designed to allow stacking of two or more molded containers.

摘要翻译： 模制容器可以包括整体底座。 底座可以包括设计成固定，支撑，定位和/或保护保持在模制容器中的一个或多个物体的突起。 突起可以间隔开以允许接近保持在基座中的物体。 突起可以包括凸缘和/或嘴唇。 模制容器可以包括盖子。 盖的内表面可以具有突出部，以将物体保持在模制容器中的适当位置。 盖子的封闭部分可牢固地卡在基座上。 盖可以附接到基座或可拆卸的。 单独的盖子可以包括便于将盖子放置在基座上的引导件。 在一个实施例中，模制容器的底座可以装配在模制容器的盖子中。 模制容器的盖和/或底座可以被设计成允许堆叠两个或多个模制容器。

公开(公告)号：US5875892A

公开(公告)日：1999-03-02

申请号：US781479

申请日：1997-01-10

申请人： Michelle Martin ,  Mark Beltran

发明人： Michelle Martin ,  Mark Beltran

IPC分类号： H01L21/673 ,  H05K13/00 ,  B65D85/00

CPC分类号： H01L21/67356 ,  H01L21/67253 ,  H01L21/67376 ,  H01L21/67386 ,  H01L21/67393 ,  H01L21/67396 ,  H05K13/0084

摘要： A packaging container including a humidity indicator system specifically designed for use in packaging electronic circuits, such as integrated circuits. The packaging container is prepared from a water and water vapor proof, anti-static packaging material and contains an opening therein. The humidity indicator system includes a humidity indicator element, a humidity comparison element and a securing system for securing the humidity indicator element to the packaging container, wherein the opening in the packaging material is closed by the humidity indicator system.

摘要翻译： 一种包括专用于包装电子电路（例如集成电路）的湿度指示器系统的包装容器。 包装容器由防水和防水的防静电包装材料制成，并在其中包含开口。 湿度指示器系统包括湿度指示器元件，湿度比较元件和用于将湿度指示器元件固定到包装容器的固定系统，其中包装材料中的开口由湿度指示器系统封闭。

公开(公告)号：US4589547A

公开(公告)日：1986-05-20

申请号：US458072

申请日：1983-01-14

申请人： Timothy C. Stewart ,  Leo Ofman ,  Kelvin R. Blair ,  Randolph M. Gregg

发明人： Timothy C. Stewart ,  Leo Ofman ,  Kelvin R. Blair ,  Randolph M. Gregg

IPC分类号： H01L21/673 ,  B65D73/02

CPC分类号： H01L21/67333 ,  H01L21/67356

摘要： A carrier (30) for thin flat electronic devices (36) is provided which has a high volumetric efficiency and is adapted for use with automatic handling equipment. The carrier (30) comprising a hollow tube (31) having a longitudinal interior bore (35) in which is placed a longitudinal cage of metal rails (38) which surround, guide, and hold the devices (36) in a stacked relationship. At least six rails (38) are required to avoid binding and jamming of devices (36) in bore (35). End caps (33a-b) and a moveable resilient plug (34) are used to retain the devices (36) firmly but gently in place to prevent chipping and scratching of the devices (36) during handling and shipment of the carrier (30), and to vary the capacity of the carrier (30). The carrier (30) is rugged, reuseable, and has a volumetric efficiency (devices/unit volume) three to eighteen times higher than prior art egg-crate type device carriers.

摘要翻译： 提供了一种用于薄平板电子设备（36）的载体（30），其具有高体积效率并且适于与自动处理设备一起使用。 载体（30）包括具有纵向内孔（35）的中空管（31），其中放置有以堆叠关系围绕，引导和保持装置（36）的金属轨道（38）的纵向保持架。 需要至少六个轨道（38）以避免孔（35）中的装置（36）的装订和堵塞。 使用端盖（33a-b）和可移动的弹性塞（34）来牢固地将装置（36）保持在温和的位置，以防止装载（30）的装卸过程中的装置（36）的碎裂和划伤， 并且改变载体（30）的容量。 载体（30）是坚固的，可再利用的，并且具有比现有技术的蛋箱式装置载体高三到十八倍的体积效率（装置/单位体积）。

公开(公告)号：US4200191A

公开(公告)日：1980-04-29

申请号：US934529

申请日：1978-08-17

申请人： Yoshiaki Nakamura ,  Takaharu Abe

发明人： Yoshiaki Nakamura ,  Takaharu Abe

IPC分类号： H01L21/683 ,  B65D85/30 ,  H01L21/301 ,  H01L21/67 ,  H01L21/673 ,  B65D73/02

CPC分类号： H01L21/67356 ,  B65D85/30 ,  H01L21/67366 ,  H01L21/67386

摘要： A container for semiconductor chips is disclosed. The container includes an annular ring having a first diameter and an annular lower casing having a second diameter, greater than the first diameter. The annular lower container houses the annular ring. A plastic film, holding the semiconductor chips, is stretched over an annular opening in the annular ring. An upper container mates with the lower container to form an air-tight housing for the annular ring. The upper container is shaped in such a manner that the upper container fixes the annular ring in place but does not contact the semiconductor chip.

摘要翻译： 公开了一种用于半导体芯片的容器。 容器包括具有第一直径的环形圈和具有大于第一直径的第二直径的环形下壳体。 环形下部容器容纳环形环。 保持半导体芯片的塑料膜在环形环中的环形开口上被拉伸。 上容器与下容器配合形成用于环形圈的气密壳体。 上部容器成形为使得上部容器将环形环固定就位，但不接触半导体芯片。