公开(公告)号：US20250095974A1

公开(公告)日：2025-03-20

申请号：US18767424

申请日：2024-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongseok LEE ,  Jong Min LEE ,  Taekyoon PARK ,  Chae Sun KIM ,  Hae Rang ROH

IPC: H01J37/32 ,  G01N21/27 ,  H01L21/67

Abstract: A substrate processing method includes collecting a plurality of pieces of optical emission spectrometry data including a wavelength, intensity of the wavelength, and time using optical emission spectrometry on a plurality of substrates, selecting a selected wavelength band having a high correlation with an endpoint of an etching process from the plurality of pieces of optical emission spectrometry data, preprocessing the plurality of pieces of optical emission spectrometry data to generate a selected dataset, generating a principal component analysis model using the selected dataset, generating a probability distribution model capable of clustering data of the principal component analysis model, and performing the etching process on a process substrate using the principal component analysis model and the probability distribution model.