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    Modular Sensor Platform
    8.
    发明申请
    Modular Sensor Platform 审中-公开
    模块化传感器平台

    公开(公告)号：US20150157220A1

    公开(公告)日：2015-06-11

    申请号：US14286620

    申请日：2014-05-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ram Fish ,  James Schuessler ,  Julien Penders ,  Lindsay Brown ,  Frank Settemo Nuovo ,  Sheldon George Phillips ,  Tom Torfs

    IPC: A61B5/0205 ,  A61B5/021 ,  A61B5/04 ,  A61B5/11 ,  A61B5/00 ,  A61B5/0402

    CPC classification number: A61B5/02055 ,  A61B5/0002 ,  A61B5/01 ,  A61B5/02141 ,  A61B5/0402 ,  A61B5/0533 ,  A61B5/1118 ,  A61B5/14552 ,  A61B5/681 ,  A61B5/7278 ,  A61B2560/0242 ,  A61B2560/045

    Abstract: Exemplary embodiments for reconfiguring a storage system comprise a modular sensor platform, comprising: a base module comprising, a display, a processor, a memory and a communication interface; a band removably coupled to the base module such that the band is replaceable with different types of bands; and a sensor module that collects data from a user, the sensor module in communication with the base module and removably coupled to the band such that the sensor module is replaceable with different types of sensor modules, the sensor module further comprising a plurality of sensor units that are removably coupled to the sensor module such that individual sensor units are replaceable with different types of sensor units.

    Abstract translation: 用于重新配置存储系统的示例性实施例包括模块化传感器平台，包括：基本模块，包括显示器，处理器，存储器和通信接口; 带可移除地耦合到所述基本模块，使得所述带可以用不同类型的带替换; 以及传感器模块，其从用户收集数据，所述传感器模块与所述基本模块通信并可移除地耦合到所述带，使得所述传感器模块可以用不同类型的传感器模块替换，所述传感器模块还包括多个传感器单元 其可拆卸地联接到传感器模块，使得各个传感器单元可以用不同类型的传感器单元替换。

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