公开(公告)号：US20240421011A1

公开(公告)日：2024-12-19

申请号：US18435689

申请日：2024-02-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： WanSun Kim ,  HYUNGGIL BAEK ,  Hojin Seo

IPC: H01L23/18 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/18

Abstract: A semiconductor package includes a package substrate, a semiconductor chip that is bonded to the package substrate, and a stiffener that is adjacent to the semiconductor chip and is bonded to the package substrate. The stiffener includes a plurality of corner parts that are bonded to a plurality of corner regions of the package substrate, and a plurality of leg parts that are spaced apart from the package substrate. Each of the plurality of leg parts connects corresponding two leg parts of the plurality of leg parts with each other.