公开(公告)号：US12176287B2

公开(公告)日：2024-12-24

申请号：US18409447

申请日：2024-01-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Won Kyu Han ,  Myeongsoo Lee ,  Rakhwan Kim ,  Woojin Jang

IPC: H01L23/528 ,  H01L23/522 ,  H01L27/092

Abstract: An integrated circuit device includes a substrate and a first electrically insulating layer on the substrate. An electrically conductive contact plug is provided, which extends at least partially through the first electrically insulating layer. The contact plug includes a protrusion having a top surface that is spaced farther from the substrate relative to a top surface of a portion of the first electrically insulating layer extending adjacent the contact plug. An electrically conductive line is provided with a terminal end, which extends on a first portion of the protrusion. A second electrically insulating layer is provided, which extends on a second portion of the protrusion and on the first electrically insulating layer. The second electrically insulating layer has a sidewall, which extends opposite a sidewall of the terminal end of the electrically conductive line.

公开(公告)号：US20220199526A1

公开(公告)日：2022-06-23

申请号：US17406887

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won Kyu Han ,  Myeongsoo Lee ,  Rakhwan Kim ,  Woojin Jang

IPC: H01L23/528 ,  H01L23/522

Abstract: An integrated circuit device includes a substrate and a first electrically insulating layer on the substrate. An electrically conductive contact plug is provided, which extends at least partially through the first electrically insulating layer. The contact plug includes a protrusion having a top surface that is spaced farther from the substrate relative to a top surface of a portion of the first electrically insulating layer extending adjacent the contact plug. An electrically conductive line is provided with a terminal end, which extends on a first portion of the protrusion. A second electrically insulating layer is provided, which extends on a second portion of the protrusion and on the first electrically insulating layer. The second electrically insulating layer has a sidewall, which extends opposite a sidewall of the terminal end of the electrically conductive line.

公开(公告)号：US11908798B2

公开(公告)日：2024-02-20

申请号：US17406887

申请日：2021-08-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Won Kyu Han ,  Myeongsoo Lee ,  Rakhwan Kim ,  Woojin Jang

IPC: H01L23/528 ,  H01L23/522 ,  H01L27/092

CPC classification number: H01L23/5283 ,  H01L23/5226 ,  H01L27/092

Abstract: An integrated circuit device includes a substrate and a first electrically insulating layer on the substrate. An electrically conductive contact plug is provided, which extends at least partially through the first electrically insulating layer. The contact plug includes a protrusion having a top surface that is spaced farther from the substrate relative to a top surface of a portion of the first electrically insulating layer extending adjacent the contact plug. An electrically conductive line is provided with a terminal end, which extends on a first portion of the protrusion. A second electrically insulating layer is provided, which extends on a second portion of the protrusion and on the first electrically insulating layer. The second electrically insulating layer has a sidewall, which extends opposite a sidewall of the terminal end of the electrically conductive line.