METHOD FOR FABRICATING PHOTOMASK LAYOUT AND METHOD FOR FABRICATING OF SEMICONDUCTOR DEVICE USING THE SAME

    公开(公告)号:US20230244136A1

    公开(公告)日:2023-08-03

    申请号:US17963263

    申请日:2022-10-11

    CPC classification number: G03F1/36

    Abstract: A method for fabricating a photomask layout is provided. The method includes: receiving a first layout including a main pattern; generating a second layout by generating an assist feature in consideration of optical properties of the main pattern in the first layout; generating a third layout by performing optical proximity correction (OPC) on a second layout; and outputting the third layout to a corrected layout when the assist feature is not generated on an ACI image of a semiconductor film etched by using a photomask generated using the third layout, as an etching mask.

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