公开(公告)号：US20200169007A1

公开(公告)日：2020-05-28

申请号：US16682852

申请日：2019-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngman SONG ,  Wooyoung Jeong ,  Gwangun Oh ,  Youngmoon Park ,  Jongmin Lee

IPC: H01Q21/29 ,  H01Q1/22

Abstract: An electronic device is provided. The electronic device includes a housing, and a printed circuit board (PCB) disposed in an inner space of the housing and includes at least one first conductive contact exposed at least partially and electrically connected to a wireless communication circuit; and an antenna structure disposed on the PCB, including at least one first antenna element and at least one second conductive contact exposed at least partially and electrically connected to the at least one first antenna element. The at least one first conductive contact is electrically connected to the at least one second conductive contact when the antenna structure is combined with the PCB. The wireless communication circuit is configured to form a directional beam through the at least one first antenna element.

公开(公告)号：US11917759B2

公开(公告)日：2024-02-27

申请号：US17433832

申请日：2021-08-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungsoo Jun ,  Changho Park ,  Jinman Kim ,  Munjin Jeong ,  Wooyoung Jeong ,  Namjun Kim ,  Yonghwa Kim ,  Dongmyeong Park ,  Youngmoon Park ,  Youngkyu Kim ,  Minwoo Yoo ,  Hyunsuk Choi

IPC: H05K1/14 ,  H04M1/02 ,  H05K1/02 ,  H05K5/00 ,  H05K7/14

CPC classification number: H05K1/14 ,  H04M1/0249 ,  H05K1/0277 ,  H05K5/0086 ,  H05K7/1427

Abstract: An electronic device includes: a housing including a plate and a back plate facing a second surface of the plate and including a planar area facing a first direction, a display module including a display disposed on a first surface of the plate, a battery and a circuit board disposed on the second surface of the plate, a first flexible substrate extending from the display module, and a second flexible substrate extending from the circuit board to the first flexible substrate across the battery. The first flexible substrate includes a first connector, and the second flexible substrate includes a second connector. The first flexible substrate and the second flexible substrate are configured such that the first connector and the second connector are coupled in a second direction different from the first direction.

公开(公告)号：US11228120B2

公开(公告)日：2022-01-18

申请号：US16682852

申请日：2019-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngman Song ,  Wooyoung Jeong ,  Gwangun Oh ,  Youngmoon Park ,  Jongmin Lee

IPC: H01Q21/29 ,  H01Q1/22 ,  H01Q21/00

Abstract: An electronic device is provided. The electronic device includes a housing, and a printed circuit board (PCB) disposed in an inner space of the housing and includes at least one first conductive contact exposed at least partially and electrically connected to a wireless communication circuit; and an antenna structure disposed on the PCB, including at least one first antenna element and at least one second conductive contact exposed at least partially and electrically connected to the at least one first antenna element. The at least one first conductive contact is electrically connected to the at least one second conductive contact when the antenna structure is combined with the PCB. The wireless communication circuit is configured to form a directional beam through the at least one first antenna element.

公开(公告)号：US11089681B2

公开(公告)日：2021-08-10

申请号：US16930589

申请日：2020-07-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： Wooyoung Jeong ,  Yongjin Woo ,  Dongjun Kim ,  Sungchang Jang

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/14

Abstract: According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.