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1.发明公开公开(公告)号：US20240319593A1
公开(公告)日：2024-09-26
申请号：US18381335
申请日：2023-10-18
发明人： Yool Kang , Taehui Kwon , Dongjun Kim , Ahram Suh , Miyeon Jung , Samjong Choi , Ohhwan Kweon , Minki Kim , Jaehyun Kim , Sunggun Shin , Seungryul Yoo , Heekyung Lee
CPC分类号： G03F7/0048 , G03F7/2004
摘要： Provided are a thinner composition, which may be generally used for an extreme ultraviolet (EUV) photoresist as well as KrF and ArF photoresists and exhibits improved performance in reduced resist coating (RRC) and edge bead removal (EBR), and which has an excellent pipe cleaning capability, and a method of treating a substrate surface by using the thinner composition. The thinner composition includes a C2-C4 alkylene glycol C1-C4 alkyl ether acetate, a C2-C3 alkylene glycol C1-C4 alkyl ether, and a cycloketone.
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公开(公告)号：US11664083B2
公开(公告)日：2023-05-30
申请号：US16855373
申请日：2020-04-22
发明人： Byoungsul Kim , Hokyong Lee , Dongjun Kim , Byungmin Choi , Kideok Han
IPC分类号： G11C29/14 , G11C29/42 , G11C29/44 , G11C29/00 , G11C11/4094 , G11C11/408 , G11C11/4091
CPC分类号： G11C29/42 , G11C11/4082 , G11C11/4085 , G11C11/4087 , G11C11/4091 , G11C11/4094 , G11C29/14 , G11C29/44 , G11C29/78 , G11C2029/4402
摘要： A memory system including a first central processing unit, a first memory module connected to the first central processing unit by a first channel, a second memory module connected to the first central processing unit by a second channel, and a third memory module connected to the first central processing unit by a third channel may be provided. Each of the first memory module, the second memory module, and the third memory module may be configured to write the same data in a data area thereof and a mirroring data area thereof in response to an address in a mirroring mode.
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公开(公告)号：US11185199B2
公开(公告)日：2021-11-30
申请号：US16534917
申请日：2019-08-07
发明人： Jiwon Choi , Dongjun Kim , Byoungin Lee
摘要： A vacuum cleaner includes a foreign-substance suction unit having a drum brush to suck foreign substances by the suction power rotating on a floor to be cleaned. The drum brush includes a rotary body having a cylindrical drum and foreign-substance collecting grooves formed at opposite end portions of the drum along a circumferential direction; a cleaning member disposed on a circumferential surface of the drum; at least one nozzle spirally extended across the cleaning member along a lengthwise direction of the drum to guide foreign substances toward the foreign-substance collecting groove; and a foreign-substance winding portion disposed in a portion of the foreign-substance collecting groove to wind the guided foreign substances. The drum brush may effectively guide, wind, and cut a hair and the like foreign substances on a carpet and the like bottom, thereby effectively preventing the hair and the like foreign substances from being piled up.
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公开(公告)号：US11583151B2
公开(公告)日：2023-02-21
申请号：US16997802
申请日：2020-08-19
发明人： Jiwon Choi , Byoungjin Lee , Kihwan Kwon , Dongjun Kim
IPC分类号： A47L9/04
摘要： A vacuum cleaner including: a cleaner body configured to generate a suction force; and a suctioner configured to have a brush drum rotatably provided on a suction port sucking foreign objects by the suction force. The brush drum includes a cylindrical drum, a blade assembly provided on an outer circumferential surface of the drum to extend along a rotational shaft direction, and a cleaning member provided on the blade assembly to clean dust or the foreign objects on a cleaning surface. The blade assembly includes a cleaning member support part configured to accommodate and support a part of the cleaning member and a stopper provided in the cleaning member at intervals to restrict the cleaning member from being deformed in an opposite direction to a rotational direction of the brush drum.
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公开(公告)号：US20150303081A1
公开(公告)日：2015-10-22
申请号：US14660093
申请日：2015-03-17
发明人： Yisung Hwang , Sugil Lee , Dongjun Kim , Yongdae Ha
IPC分类号： H01L21/67 , H01L21/687
CPC分类号： H01L21/67132 , H01L21/67144 , H01L21/67703 , H01L21/68714
摘要： A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.
摘要翻译： 芯片接合装置包括：支撑晶片的晶片保持器，其中形成管芯; 喷射器保持器，其设置在所述晶片保持器下方的所述晶片下方并支撑有助于将所述管芯与所述晶片分离的管芯喷射器; 支撑单元，其支撑待附接模具的基板; 接合单元，其从所述晶片拾取所述管芯并将所述拾取管芯附接到所述衬底; 一个接收喷射器的喷射器缓冲单元; 以及在喷射器保持器和喷射器缓冲器单元之间传送喷射器的替换单元。
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公开(公告)号：US12096906B2
公开(公告)日：2024-09-24
申请号：US17418738
申请日：2019-12-13
发明人： Jiwon Choi , Dongjun Kim , Byoungin Lee
CPC分类号： A47L9/0488 , A47L9/0477 , A47L9/0613 , A47L11/302 , A47L11/4044 , A47L7/0009 , A47L7/0066
摘要： Disclosed is a vacuum cleaner with a drum brush. The vacuum cleaner includes: a cleaner body configured to generate suction power; and a foreign object suctionor configured to suck foreign objects by the suction power. The foreign object suctionor includes a cylindrical drum brush and a drum support configured to house a part of the drum brush and rotatably support the drum brush. The drum support includes a drum housing part configured to have a shape corresponding to an outer circumferential surface of the housed drum brush, a scraper configured to be provided in the drum housing part to remove foreign objects attached to the drum brush, and a foreign object stopper configured to be provided in one area of the drum housing part at a predetermined inflow blocking distance along a rotation direction of the drum brush from the scraper. As a result, the vacuum cleaner may effectively prevent the drum brush and the scraper from being abraded or damaged by rotating with the drum brush without removing certain foreign objects.
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公开(公告)号：US11893063B2
公开(公告)日：2024-02-06
申请号：US17052795
申请日：2019-05-03
发明人： Sangdeug Kim , Dongjun Kim
IPC分类号： G06F7/00 , G06F16/903 , G06F16/907 , G06F16/957 , G06F16/953 , G06F16/9032 , G06N20/00 , G06Q30/0241
CPC分类号： G06F16/90335 , G06F16/907 , G06F16/90332 , G06F16/953 , G06F16/9574 , G06N20/00 , G06Q30/0277
摘要： Provided are an electronic device and an operating method thereof. The electronic device includes a communicator, a display, and a processor configured to receive search result data based on a search keyword from a first server through the communicator, request, from a second server through the communicator, additional information indicating whether each web page included in the search result data is an advertising page, and control the display to display the search result data, based on the additional information corresponding to the each web page and received from the second server, wherein the additional information is generated by the second server by using a training model trained using an artificial intelligence (AI) algorithm, based on whether the web page includes an advertisement pattern.
Also provided are an AI system using a machine learning algorithm such as deep learning and applications thereof.-
公开(公告)号：US11089681B2
公开(公告)日：2021-08-10
申请号：US16930589
申请日：2020-07-16
发明人： Wooyoung Jeong , Yongjin Woo , Dongjun Kim , Sungchang Jang
摘要： According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.
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公开(公告)号：US09455165B2
公开(公告)日：2016-09-27
申请号：US14660093
申请日：2015-03-17
发明人： Yisung Hwang , Sugil Lee , Dongjun Kim , Yongdae Ha
IPC分类号： H01L21/67 , H01L21/677 , H01L21/687
CPC分类号： H01L21/67132 , H01L21/67144 , H01L21/67703 , H01L21/68714
摘要： A die bonding device includes: a wafer holder supporting a wafer where a die is formed; an ejector holder disposed at the wafer holder below the wafer and supporting a die ejector that assists separating the die from the wafer; a support unit supporting a substrate where the die is to be attached; a bonding unit that picks up the die from the wafer and attaches the picked-up die to the substrate; an ejector buffer unit that receives the die ejector; and a replacing unit that transfers the die ejector between the ejector holder and the ejector buffer unit.
摘要翻译： 芯片接合装置包括：支撑晶片的晶片保持器，其中形成管芯; 喷射器保持器，其设置在所述晶片保持器下方的所述晶片下方并支撑有助于将所述管芯与所述晶片分离的管芯喷射器; 支撑单元，其支撑待附接模具的基板; 接合单元，其从所述晶片拾取所述管芯并将所述拾取管芯附接到所述衬底; 一个接收喷射器的喷射器缓冲单元; 以及在喷射器保持器和喷射器缓冲器单元之间传送喷射器的替换单元。
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