公开(公告)号：US20230211456A1

公开(公告)日：2023-07-06

申请号：US18066510

申请日：2022-12-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yea Rin Byun ,  In Kwon Kim ,  Bo Yun Kim ,  Sang Kyun Kim ,  Bo Un Yoon ,  Hyo San Lee ,  Byung Keun Hwang

IPC: B24B37/24

CPC classification number: B24B37/24

Abstract: A polishing pad for chemical mechanical polishing includes a polymer matrix and a temperature sensitive agent dispersed in the polymer matrix and constituting 1 to 40% by volume of the polishing pad, wherein the temperature sensitive agent includes a two-dimensional (2D) sheet material having a thermal conductivity of 1 W/(m·K) or more.