公开(公告)号：US20200273804A1

公开(公告)日：2020-08-27

申请号：US16567790

申请日：2019-09-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Gwang Jae JEON ,  Dong Kyu Kim ,  Jung Ho PARK ,  Yeon Ho JANG

IPC: H01L23/538 ,  H01L25/10 ,  H01L23/00 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a first redistribution structure, a first semiconductor chip disposed on the first redistribution structure, a plurality of conductive pillars disposed on the first redistribution structure, an encapsulant covering an upper surface of the first redistribution structure, and a second redistribution structure disposed on the encapsulant. The encapsulant has an upper surface having openings that expose upper surface of the plurality of conductive pillars. The second redistribution structure includes a wiring pattern and connection vias connecting the wiring pattern to the plurality of conductive pillars. An inner side surface of an opening extends vertically from a side surface of the conductive pillar.

公开(公告)号：US20220352050A1

公开(公告)日：2022-11-03

申请号：US17866866

申请日：2022-07-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong Kyu KIM ,  Jung-Ho PARK ,  Jong Youn KIM ,  Yeon Ho JANG ,  Jae Gwon JANG

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L21/48 ,  H01L21/78 ,  H01L25/00 ,  H01L21/683

Abstract: A semiconductor package includes a first semiconductor chip and a second semiconductor chip on a substrate, a barrier layer on the first semiconductor chip and the second semiconductor chip, the barrier layer having an opening through which at least a part of the first semiconductor chip is exposed, and a heat transfer part on the barrier layer, the heat transfer part extending along an upper face of the barrier layer and filling the opening.