公开(公告)号：US20230387088A1

公开(公告)日：2023-11-30

申请号：US18069318

申请日：2022-12-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： YeongBeom Ko ,  Junyun Kweon

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065 ,  H01L21/56

CPC classification number: H01L25/105 ,  H01L23/5383 ,  H01L23/49816 ,  H01L24/32 ,  H01L24/16 ,  H01L23/3107 ,  H01L23/49811 ,  H01L25/0657 ,  H01L24/14 ,  H01L24/73 ,  H01L24/05 ,  H01L24/94 ,  H01L21/561 ,  H01L2224/0401 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/94

Abstract: A semiconductor package includes at least one semiconductor module on a substrate. The semiconductor module includes a first semiconductor chip having a first surface and a second surface opposite to the first surface, a second semiconductor chip on the first surface, a plurality of conductive pillars on the first surface, and a redistribution substrate on the second semiconductor chip and the plurality of conductive pillars. The redistribution substrate has a third surface and a fourth surface opposite to the third surface. The third surface of the redistribution substrate faces the first surface of the first semiconductor chip, the plurality of conductive pillars are electrically connected to the first surface of the first semiconductor chip and the third surface of the redistribution substrate, and the fourth surface of the redistribution substrate is electrically connected to the substrate of the semiconductor package.