公开(公告)号：US20250054733A1

公开(公告)日：2025-02-13

申请号：US18424996

申请日：2024-01-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yirop Kim ,  Seungbin Lim ,  Songyun Kang ,  Kyungsun Kim ,  Kuihyun Yoon ,  Jihwan Kim ,  Heewon Min ,  Insoo Lee ,  Junho Lee ,  Seunghee Cho

IPC: H01J37/32

Abstract: An apparatus for processing a substrate may include a process chamber, a substrate-supporting module, an upper electrode module and a valve module. The process chamber may have a substrate-processing region configured to process the substrate using process gases. The substrate-supporting module may be arranged in a lower region of the process chamber to support the substrate. The upper electrode module may be arranged in an upper region of the process chamber. The valve module may be provided to the upper electrode module to control a supplying of the process gases into the substrate-processing region.