公开(公告)号：US20250070079A1

公开(公告)日：2025-02-27

申请号：US18622040

申请日：2024-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： YongChul SHIN ,  Minwoo Rhee ,  Sujie Kang ,  Sun-woo Park ,  Nungpyo Hong ,  Kyeongbin Lim

IPC: H01L23/00 ,  B32B43/00 ,  H01L21/78

Abstract: A semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.