公开(公告)号：US20230178280A1

公开(公告)日：2023-06-08

申请号：US18075814

申请日：2022-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sumin KIM ,  Minwoo Rhee ,  Yongchul Shin ,  Ilyoung Han ,  Nungpyo Hong ,  Seungdon Lee ,  Kyeongbin Lim

IPC: H01F13/00 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01F13/00 ,  H01L25/50 ,  H01L23/564

Abstract: A die alignment method includes vertically aligning a first die comprising first magnetic patterns and a second die comprising second magnetic patterns with each other using magnetic force between the first magnetic patterns and the second magnetic patterns. Each of the first magnetic patterns and the second magnetic patterns comprises a horizontally magnetically anisotropic material. The first magnetic patterns and the second magnetic patterns do not vertically overlap each other when the first die and the second die are vertically aligned with each other.

公开(公告)号：US11942344B2

公开(公告)日：2024-03-26

申请号：US17224564

申请日：2021-04-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Mingi Hong ,  Choongbo Shim ,  Heejin Kim ,  Nungpyo Hong

IPC: H01L21/67 ,  G01J5/00 ,  G01K13/00

CPC classification number: H01L21/67248 ,  G01J5/00 ,  G01K13/00 ,  H01L21/67103

Abstract: In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.

公开(公告)号：US20250070079A1

公开(公告)日：2025-02-27

申请号：US18622040

申请日：2024-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： YongChul SHIN ,  Minwoo Rhee ,  Sujie Kang ,  Sun-woo Park ,  Nungpyo Hong ,  Kyeongbin Lim

IPC: H01L23/00 ,  B32B43/00 ,  H01L21/78

Abstract: A semiconductor package manufacturing method includes: bonding a carrier to a wafer; dicing the wafer together with the carrier which is bonded to the wafer into a plurality of die-carrier assemblies, each of the plurality of die-carrier assemblies including a die and a carrier piece bonded to the die; disposing the plurality of die-carrier assemblies on a target substrate; and separating the carrier pieces from the plurality of die-carrier assemblies by irradiating the plurality of die-carrier assemblies with light.

公开(公告)号：US11581202B2

公开(公告)日：2023-02-14

申请号：US17078190

申请日：2020-10-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ilyoung Han ,  Kyoungran Kim ,  Chulhyun Park ,  Minjae Shin ,  Geunsik Oh ,  Hyunjin Lee ,  Soonwon Lee ,  Nungpyo Hong

IPC: B32B43/00 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: A substrate debonding apparatus configured to separate a support substrate attached to a first surface of a device substrate by an adhesive layer, the substrate debonding apparatus including a substrate chuck configured to support a second surface of the device substrate, the second surface being opposite to the first surface of the device substrate; a light irradiator configured to irradiate light to an inside of the adhesive layer; and a mask between the substrate chuck and the light irradiator, the mask including an opening through which an upper portion of the support substrate is exposed, and a first cooling passage or a second cooling passage, the first cooling passage being configured to provide a path in which a coolant is flowable, the second cooling passage being configured to provide a path in which air is flowable and to provide part of the air to a central portion of the opening.