Abstract:
Provided is a stretchable supercapacitor and a method of manufacturing the same. The stretchable supercapacitor includes a separator between first and second current collectors. The first and second current collectors each including an active material. The second current collector is on the first current collector. The separator includes an electrolyte. Each of the separator, the first current collector and the second current collector includes an elastic polymer layer. The first and second current collectors may each have a 3-dimensional nano-pore structure. The stretchable supercapacitor may further include a first electrode in contact with the first current collector and a second electrode in contact with the second current collector. The elastic polymer layers may include at least one of styrene-b-butadiene-b-styrene (SBS), polyurethane, polyurethane acrylate, acrylate polymer, acrylate terpolymer, and silicone-based polymer.
Abstract:
A chemical mechanical polishing apparatus includes a fixing portion; and a rotary body module including a rotating shaft rotatably installed on the fixing portion, a first rotating unit connected to the rotating shaft and on which a wafer is mounted, and a second rotating unit disposed around the first rotating unit and on which a retainer ring is mounted, wherein the fixing portion comprises a first driving member disposed above the first rotating unit and a second driving member disposed above the second rotating unit, wherein the first and second driving members are comprised of a magnet or an electromagnet, wherein a first magnet, disposed opposite to the first driving member, is provided in the first rotating unit, and a second magnet, disposed opposite to the second driving member, is provided in the second rotating unit, and wherein the first rotating unit and the second rotating unit are independently tilted.
Abstract:
A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.
Abstract:
A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.