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公开(公告)号:US10284198B2
公开(公告)日:2019-05-07
申请号:US15282291
申请日:2016-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Yeol Lee , Seokil Kim , Hoiju Chung , Yongjae Shin , YouKeun Han
Abstract: A memory system includes a memory module and a memory controller. The memory module includes a plurality of memory devices with corresponding ZQ calibration circuits therein. The memory controller, which is electrically coupled to the memory module, includes a ZQ global managing circuit therein. This ZQ global managing circuit is configured to determine a plurality of calibration values associated the corresponding ZQ calibration circuits in the plurality of memory devices, in response to calibration result data generated by the plurality of ZQ calibration circuits. The memory module is mounted within a memory slot. In addition, the plurality of calibration values account for signal loading characteristics of the memory module within the memory slot.
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公开(公告)号:US20170099050A1
公开(公告)日:2017-04-06
申请号:US15282291
申请日:2016-09-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-Yeol Lee , Seokil Kim , Hoiju Chung , Yongjae Shin , YouKeun Han
CPC classification number: H03K19/0005 , G11C7/1057 , G11C2207/2254
Abstract: A memory system includes a memory module and a memory controller. The memory module includes a plurality of memory devices with corresponding ZQ calibration circuits therein. The memory controller, which is electrically coupled to the memory module, includes a ZQ global managing circuit therein. This ZQ global managing circuit is configured to determine a plurality of calibration values associated the corresponding ZQ calibration circuits in the plurality of memory devices, in response to calibration result data generated by the plurality of ZQ calibration circuits. The memory module is mounted within a memory slot. In addition, the plurality of calibration values account for signal loading characteristics of the memory module within the memory slot.
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