公开(公告)号：US20180040950A1

公开(公告)日：2018-02-08

申请号：US15648794

申请日：2017-07-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Woo-Sup LEE ,  Youn-Ju KIM ,  Kyeong-Jo KEUM ,  Jung-Sik PARK

IPC: H01Q1/52 ,  H04B5/02 ,  H04B5/00

CPC classification number: H01Q1/526 ,  G06K19/07779 ,  H04B5/0031 ,  H04B5/0087 ,  H04B5/02

Abstract: An electronic device, of the present disclosure, may include: a housing; an antenna unit disposed inside the housing and including a conductive pattern configured to generate a magnetic field; a plate comprising at least a part of the housing and including a material through which at least a part of the magnetic field generated by the conductive pattern can pass; and a control circuit configured to transmit at least one piece of payment information to an external device using the conductive pattern, wherein the antenna unit including the conductive pattern includes: a first coil having a first plurality of turns that is substantially perpendicular to one surface of the plate; and a second coil having a second plurality of turns that is substantially parallel to the surface of the plate, and a shielding structure comprising a shielding material is disposed inside the first coil or below the second coil. The electronic device, according to various example embodiments of the present disclosure, can implement various read-out methods (for example, a Near Field Communication (NFC) method and a Magnetic Secure Transmission (MST) method) with one module due to the shape of the shielding structure disposed in the antenna unit.

公开(公告)号：US20200175498A1

公开(公告)日：2020-06-04

申请号：US16781629

申请日：2020-02-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Sup LEE ,  Hyun-Ju HONG ,  Youn-Ju KIM ,  Jae-Bong CHUN ,  Jung-Sik PARK

IPC: G06Q20/32 ,  H02J50/00 ,  H02J50/80 ,  H02J7/00 ,  H01Q1/24 ,  H01Q1/22 ,  H02J50/10 ,  H01Q7/00 ,  G06K19/077

Abstract: According to various embodiments of the present disclosure, an electronic device may include a housing, a conductive pattern that is arranged within the housing and is formed to generate a magnetic field, a plate that forms at least a part of a first surface of the housing and includes a material that at least partially transmits the magnetic field generated by the conductive pattern, and a communication circuit that is configured to transmit at least one transaction information to an external device by using the conductive pattern. The conductive pattern may include a first end that is electrically connected to the communication circuit, a second end that is electrically connected to the communication circuit, and a coil that is connected between the first end and the second end and includes a plurality of turns that are substantially parallel to a surface of the plate.

公开(公告)号：US20190251549A1

公开(公告)日：2019-08-15

申请号：US16391097

申请日：2019-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woo-Sup LEE ,  Hyun-Ju HONG ,  Youn-Ju KIM ,  Jae-Bong CHUN ,  Jung-Sik PARK

IPC: G06Q20/32 ,  H02J50/80 ,  H02J7/02 ,  H02J7/00 ,  H01Q1/24 ,  H02J50/10 ,  H01Q7/00 ,  G06K19/077 ,  H01Q1/22

Abstract: According to various embodiments of the present disclosure, an electronic device may include a housing, a conductive pattern that is arranged within the housing and is formed to generate a magnetic field, a plate that forms at least a part of a first surface of the housing and includes a material that at least partially transmits the magnetic field generated by the conductive pattern, and a communication circuit that is configured to transmit at least one transaction information to an external device by using the conductive pattern. The conductive pattern may include a first end that is electrically connected to the communication circuit, a second end that is electrically connected to the communication circuit, and a coil that is connected between the first end and the second end and includes a plurality of turns that are substantially parallel to a surface of the plate.

公开(公告)号：US20180301790A1

公开(公告)日：2018-10-18

申请号：US15950450

申请日：2018-04-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youn-Ju KIM ,  Jae-Woong JEON ,  Kyeong-Jo KEUM

IPC: H01Q1/24 ,  H05K1/02 ,  H02J7/02 ,  H01Q7/00

Abstract: Disclosed are various embodiments related to an electronic device including a coil. The electronic device may include: a housing including a first face facing a first direction and a second face facing a second direction different from the first direction; and a flexible printed circuit board and a control circuit disposed between the first and second faces. The flexible printed circuit board may include a first coil including at least one turn, a second coil including at least one turn, and a third coil including at least one turn. At least a part of the second coil may surround a first portion of the first coil, a second portion of the first coil may surround at least a part of the second coil, a third portion of the first coil may surround the second portion of the first coil, and at least a part of the third coil may be disposed between at least a part of the second portion of the first coil and at least a part of the third portion of the first coil. The control circuit may be configured to: transmit a signal outward by a first transmission method using the first coil; transmit a signal outward by a second transmission method using the second coil; and transmit a signal outward by a third transmission method using the third coil.