公开(公告)号：US20170022610A1

公开(公告)日：2017-01-26

申请号：US15066318

申请日：2016-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eun-Sung Seo ,  Yong-Kwon Kim ,  Young-Jin Noh ,  Young-Chang Song ,  Jae-Myung Choe ,  Ji-Hoon Choi ,  Sang-Cheol HA

IPC: C23C16/455 ,  C23C16/44 ,  C23C16/24

CPC classification number: C23C16/4412 ,  C23C16/045 ,  C23C16/45502 ,  C23C16/45546 ,  C23C16/45578 ,  C23C16/4584 ,  H01L28/00

Abstract: A wafer processing apparatus may include a reaction tube extending in a vertical direction and defining a process chamber for receiving a boat that holds a plurality of wafers. A gas injector may be configured to supply a reaction gas into the process chamber and may include a gas distributor extending in the vertical direction in the reaction tube. The gas injector may have a plurality of ejection holes for spraying the reaction gas. An inner diameter of the gas distributor may be at least 10 mm, and a sectional area ratio of the total sectional area of the ejection holes to a sectional area of the gas distributor is about 0.3 or less.

Abstract translation: 晶片处理装置可以包括在垂直方向上延伸的反应管并且限定用于接纳保持多个晶片的船的处理室。 气体注射器可以被配置为将反应气体供应到处理室中，并且可以包括在反应管中沿垂直方向延伸的气体分布器。 气体喷射器可以具有用于喷射反应气体的多个喷射孔。 气体分配器的内径可以为至少10mm，并且喷射孔的总截面积与气体分配器的截面面积的截面积比为约0.3以下。