公开(公告)号：US20230122101A1

公开(公告)日：2023-04-20

申请号：US17959793

申请日：2022-10-04

Applicant: Samsung Electronics Co., Ltd. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Young-Min KIM ,  Eunha LEE ,  Myoungho JEONG ,  Young-Hoon KIM ,  Sang-Hyeok YANG

IPC: G01N23/20058 ,  G06T7/70 ,  G06V10/82 ,  G06V10/762 ,  G06V10/764

Abstract: A method for two-dimensional mapping of crystal information of a polycrystalline material may include acquiring a diffraction pattern acquired by scanning an electron beam to a polycrystalline material, generating a plurality of clusters by applying a clustering algorithm to the acquired diffraction pattern based on unsupervised learning, acquiring crystal information of the polycrystalline material by applying a parallel deep convolutional neural network (DCNN) algorithm to each of the plurality of generated clusters based on supervised learning, and generating a two-dimensional image in which the acquired crystal information is mapped.

公开(公告)号：US20170048970A1

公开(公告)日：2017-02-16

申请号：US15093111

申请日：2016-04-07

Applicant: Samsung Electronics Co., Ltd.

Inventor： Iksung Park ,  Heeyoub KANG ,  Young-Min KIM ,  Eunji YOU ,  Hwi-jong YOO

IPC: H05K1/02 ,  H01L25/18 ,  G11C5/00 ,  H01L23/60 ,  G11C5/02 ,  H01L25/065 ,  H01L23/538

CPC classification number: H05K1/0259 ,  G11C5/005 ,  G11C5/025 ,  G11C5/04 ,  H01L23/5386 ,  H01L23/60 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0268 ,  H05K3/0052 ,  H05K2201/10159

Abstract: Disclosed is a printed circuit hoard. The printed circuit board includes a plurality of insulation layers and a plurality of pattern layers alternately stacked, The printed circuit board includes a plurality of device areas on which semiconductor packages are mounted and a peripheral area adjacent the device areas. An electrostatic discharge pattern is in a respective pattern layer among the plurality of pattern layers and is disposed at a boundary region between a respective device area of the plurality of device areas and the peripheral area.

Abstract translation: 公开了印刷电路板。 印刷电路板包括交替堆叠的多个绝缘层和多个图案层。印刷电路板包括多个装配区域，半导体封装件安装在该区域上以及与该区域相邻的外围区域。 静电放电图案位于多个图案层中的各图案层中，并且设置在多个器件区域的各个器件区域与周边区域之间的边界区域。